Pressure sensing device incorporating pressure sensing chip in resin case
View Patent ↗A pressure sensor device includes a pressure sensor chip containing a diaphragm, piezo-resistors, an amplifying circuit and various kinds of adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined so that their respective through holes communicate with each other. The metallic member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected to form a pressure sensor cell. With an O-ring attached to the metallic member and with the resin case pressed from above, the pressure sensor cell is secured to an enclosure, such as an oil enclosing block. Using a connector having a bending section and a threaded section, the pressure sensor cell can be secured to the connector by bending the bending section over the pressure sensor cell. The threaded section can be screwed into the enclosure.
1. A pressure sensor cell comprising:
a pressure sensor chip having a pressure receiving section for receiving pressure and a converting unit for converting strain of the pressure receiving section to an electric signal, the strain being exerted by the pressure received by the pressure receiving section;
a base member having a first face, a second face, and a through hole extending through the first face and the second face;
a metallic pressure introducing unit having a first face, a second face, and a through hole extending through the first face and the second face; and
a resin case having a signal terminal for outputting the electric signal from the converting unit of the pressure sensor chip,
wherein the pressure receiving section faces the through hole of the base member, and the pressure sensor chip is joined to the second face of the base member,
wherein the through hole of the pressure introducing unit communicates with the through hole of the base member, and the second face of the pressure introducing unit is joined to the first face of the base member,
wherein the resin case is bonded to the pressure introducing unit, and
wherein the pressure sensor chip and the signal terminal are electrically connected by a wiring.
2. The pressure sensor cell according to ciaim 1 , further including a metallic thin film on the first face of the base member.
3. The pressure sensor cell according to claim 2 , further including a metallic material disposed between the pressure introducing unit and the base member, wherein the second face of the pressure introducing unit is joined to the first face of the base with the metallic thin film.
4. The pressure sensor cell according to claim 1 , wherein the second face of the pressure introducing unit is bonded to the first face of the base member with an adhesive.
5. The pressure sensor cell according to claim 3 , wherein the pressure introducing unit comprises one of a metallic plate or a metallic pipe.
6. The pressure sensor cell according to claim 4 , wherein the pressure introducing unit comprises one of a metallic plate or a metallic pipe.
7. The pressure sensor cell according to claim 1 , wherein the base member is made of glass and the pressure sensor chip is joined to the glass base member by electrostatic bonding.
8. The pressure sensor cell according to claim 1 , wherein the base member and the pressure sensor chip are both made of silicon, and the pressure sensor chip is joined to the base member with a sealing glass.
9. The pressure sensor cell according to claim 1 , wherein the pressure introducing unit is made of the 42 alloy, with at least one of nickel and gold plating.
10. A pressure sensor cell comprising:
a pressure sensor chip having a pressure receiving section for receiving pressure and a converting unit for converting strain of the pressure receiving section to an electric signal, the strain being exerted by the pressure received by the pressure receiving section;
a base member having a first face, a second face, and a through hole extending through the first face and the second face;
a metallic pressure introducing unit having a first face, a second face, and a through hole extending through the first face and the second face;
a resin case having a signal terminal for outputting the electric signal from the converting unit of the pressure sensor chip; and
a metallic thin film on the first face of the base member;
wherein the pressure receiving section faces the throuah hole of the base member, and the pressure sensor chip is joined to the second face of the base member;
wherein the through hole of the pressure introducing unit communicates with the through hole of the base member, and the second face of the pressure introducing unit is joined to the first face of the base member;
wherein the resin case is bonded to the pressure introducing unit;
wherein the pressure sensor chip and the signal terminal are electrically connected by a wiring;
wherein the metallic thin film is formed with three layers, including a chromium film, a platinum film, and a gold film.
11. The pressure sensor cell according to claim 1 , wherein the pressure introducing unit has a stepped portion protruding outwardly from a side thereof at a position midway from the first and second faces thereof, and wherein the stepped portion is bonded to the resin case.
12. The pressure sensor cell according to claim 1 , wherein the pressure introducing unit protrudes outside more than an end face of the resin case at each end thereof in at least one direction.
13. The pressure sensor cell according to claim 1 , wherein the pressure introducing unit has a support on the outside more than an end face of the resin case at each end thereof in at least one direction, the support being in contact with a different member that is integrated together with the pressure introducing unit.
14. A pressure sensor device comprising:
a pressure sensor cell comprising:
a pressure sensor chip having a pressure receiving section for receiving pressure and a converting unit for converting strain of the pressure receiving section to an electric signal, the strain being exerted by pressure received by the pressure receiving section;
a base member having a first face, a second face, and a through hole extending through the first face and the second face;
a metallic pressure introducing unit having a first face, a second face, and a through hole extending through the first face and the second face; and
a resin case having a signal terminal for outputting the electric signal from the converting unit of the pressure sensor chip,
wherein the pressure receiving section faces the through hole of the base member, and the pressure sensor chip is joined to the second face of the base member,
wherein the through hole of the pressure introducing unit communicates with the through hole of the base member, and the second face of the pressure introducing unit is joined to the first face of the base member,
wherein the resin case is bonded to the pressure introducing unit, and
wherein the pressure sensor chip and the signal terminal are electrically connected by a wiring; and
means for mounting the pressure sensor cell to an enclosure.
15. The pressure sensor device according to claim 14 , wherein the mounting means comprises:
a connector member provided with a disposing section for disposing the pressure sensor cell therein, the connector member having an output terminal that is integrally molded therewith, one end of the output terminal being electrically connected to the signal terminal of the pressure sensor cell and the other end of the output terminal projecting externally outwardly; and
a joint member comprising:
a threaded section having a threaded portion and a through hole extending through the threaded portion;
a containing section having a securing section for securing the connector member and containing the pressure sensor cell disposed in the connector member; and
a sealing unit;
wherein the pressure sensor cell is disposed in the connector member so that an opening of the through hole on the first face of the pressure introducing unit communicates with a pressure-transmitting medium from the enclosure,
wherein the signal terminal of the pressure sensor cell is electrically connected to the output terminal,
wherein the pressure sensor cell, the connector member, and the joint member are joined, with the pressure sensor cell disposed between the connector member and the joint member so that the through hole of the threaded section communicates with the through hole of the pressure introducing unit, and
wherein the sealing unit seals a space between the pressure introducing unit and the joint member.
16. The pressure sensor device according to claim 14 , wherein the mounting means comprises a fixture for holding the sensor cell in a recess formed in the enclosure, the fixture having an opening through which the signal terminal extends externally outwardly and being mounted to the enclosure with fasteners.
17. The pressure sensor device according to claim 14 , wherein the mounting means comprises a tab for holding the sensor cell in a recess formed in the enclosure, the tab having an opening through which the signal terminal extends externally outwardly, the tab securing the sensor cell to the enclosure.
18. The pressure sensor device according to claim 14 , further including a metallic thin film on the first face of the base member.
19. The pressure sensor device according to claim 18 , further including a metallic material disposed between the pressure introducing unit and the base member, wherein the second face of the pressure introducing unit is joined to the first face of the base with the metallic thin film.
20. The pressure sensor device according to claim 14 , wherein the second face of the pressure introducing unit is bonded to the first face of the base member with an adhesive.
21. The pressure sensor device according to claim 19 , wherein the pressure introducing unit comprises one of a metallic plate or a metallic pipe.
22. The pressure sensor device according to claim 20 , wherein the pressure introducing unit comprises one of a metallic plate or a metallic pipe.
23. The pressure sensor device according to claim 14 , wherein the base member is made of glass and the pressure sensor chip is joined to the glass base member by electrostatic bonding.
24. The pressure sensor device according to claim 14 , wherein the base member and the pressure sensor chip are both made of silicon, and the pressure sensor chip is joined to the base member with a sealing glass.
25. The pressure sensor device according to claim 14 , wherein the pressure introducing unit is made of the 42 alloy, with at least one of nickel and gold plating.
26. A pressure sensor device comprising:
pressure sensor cell comprising:
a pressure sensor chip having a pressure receiving section for receiving pressure and a converting unit for converting strain of the pressure receiving section to an electric signal, the strain being exerted by pressure received by the pressure receiving section;
a base member having a first face, a second face, and a through hole extending through the first face and the second face;
a metallic pressure introducing unit having a first face, a second face, and a through hole extending through the first face and the second face;
a resin case having a signal terminal for outputting the electric signal from the converting unit of the pressure sensor chip;
a metallic thin film on the first face of the base member; and
means for mounting the pressure sensor cell to an enclosure
wherein the pressure receiving section faces the through hole of the base member, and the pressure sensor chip is joined to the second face of the base member;
wherein the through hole of the pressure introducing unit communicates with the through hole of the base member, and the second face of the pressure introducing unit is joined to the first face of the base member;
wherein the resin case is bonded to the pressure introducing unit; and
wherein the pressure sensor chip and the signal terminal are electrically connected by a wiring; and
wherein the metallic thin film is formed with three layers, including a chromium film, a platinum film, and a gold film.
27. The pressure sensor device according to claim 14 , wherein the pressure introducing unit has a stepped portion protruding outwardly from a side thereof at a position midway from the first and second faces thereof, and wherein the stepped portion is bonded to the resin case.
28. The pressure sensor device according to claim 14 , wherein the pressure introducing unit protrudes outside more than an end face of the resin case at each end thereof in at least one direction.
29. The pressure sensor device according to claim 14 , wherein the pressure introducing unit has a support on the outside more than an end face of the resin case at each end thereof in at least one direction, the support being in contact with a different member that is integrated together with the pressure introducing unit.