Manufacturing method for compound semiconductor device
View Patent ↗It is the object of the present invention to provide a manufacturing method for a compound semiconductor device capable of removing remaining organic substances without deteriorating a characteristic of the compound semiconductor device, wherein a surface of an i-type AlGaAs schottky layer is cleaned in a state where light is blocked using either one of ozonized (O 3 ) water whose ozone concentration is at most 13 mg/L and hydrogenated (H 2 ) water whose hydrogen ion concentration (pH) is from 6 to 8 inclusive, or using both of the ozonized water and the hydrogenated water after a schottky electrode made of Ti/Al/Ti is evaporated onto the exposed i-type AlGaAs schottky layer and a lift-off operation is performed using a remover.
1. A method for manufacturing a compound semiconductor device that is a field-effect transistor made up of a compound semiconductor layer including GaAs, AlGaAs, InGaAs, InGaP or InP, said method comprising:
forming a resist pattern on said compound semiconductor layer;
removing said resist pattern; and
cleaning one of a contact layer and a schottky layer of said compound semiconductor layer using both ozone-containing water and hydrogen-containing water.
2. The method according to claim 1 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning said one of said contact layer and said schottky layer using ozone-containing water, having an ozone concentration of at most 13 mg/L, and said hydrogen-containing water.
3. The method according to claim 2 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning said one of said contact layer and said schottky layer in a state where light is blocked.
4. The method according to claim 3 , wherein
said one of said contact layer and said schottky layer includes GaAs, AlGaAs, InGaAs, InGaP or InP.
5. The method according to claim 4 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning a schottky layer on which a gate electrode is formed.
6. The method according to claim 3 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning a schottky layer on which a gate electrode is formed.
7. The method according to claim 2 , wherein said one of said contact layer and said schottky layer includes GaAs, AlGaAs, InGaAs, InGaP or InP.
8. The method according to claim 7 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning a schottky layer on which a gate electrode is formed.
9. The method according to claim 2 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning a schottky layer on which a gate electrode is formed.
10. The method according to claim 1 , wherein
said one of said contact layer and said schottky layer includes GaAs, AlGaAs, InGaAs, InGaP or InP.
11. The method according to claim 10 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning a schottky layer on which a gate electrode is formed.
12. The method according to claim 1 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning said one of said contact layer and said schottky layer in a state where light is blocked.
13. The method according to claim 12 , wherein
said one of said contact layer and said schottky layer includes GaAs, AlGaAs, InGaAs, InGaP or InP.
14. The method according to claim 13 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning a schottky layer on which a gate electrode is formed.
15. The method according to claim 1 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning a schottky layer on which a gate electrode is formed.
16. The method according to claim 15 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning said one of said contact layer and said schottky layer in a state where light is blocked.
17. The method according to claim 1 , wherein
cleaning said one of said contact layer and said schottky layer comprises cleaning said one of said contact layer and said schottky layer by an oxidation effect of said ozone-containing water or a deoxidation effect of said hydrogen-containing water.