Microelectronic imaging units and methods of manufacturing microelectronic imaging units
View Patent ↗Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes providing a plurality of imaging dies on a microfeature workpiece. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes attaching a plurality of covers to corresponding imaging dies, cutting the microfeature workpiece to singulate the imaging dies, and coupling the singulated dies to a support member. The covers can be attached to the imaging dies before or after the workpiece is cut.
1. A method of manufacturing a plurality of imaging dies on a microfeature workpiece, the method comprising:
constructing a plurality of imaging dies on the microfeature workpiece, the individual imaging dies including an image sensor and a plurality of bond-pads operably coupled to the image sensor; and
attaching a plurality of covers to corresponding imaging dies on the workpiece with discrete portions of an adhesive, the discrete portions of the adhesive being disposed between the associated cover and die and outboard the image sensor.
2. The method of claim 1 wherein attaching the covers to the imaging dies comprises:
depositing the discrete portions of the adhesive onto the covers and/or the imaging dies; and placing the covers on the corresponding imaging dies such that the discrete portions of the adhesive define a cell between the cover and the die.
3. The method of claim 1 wherein attaching the covers to the imaging dies comprises coupling the covers to the imaging dies such that the individual covers are inboard the external contacts.
4. The method of claim 1 wherein the discrete portions of the adhesive are disposed between the associated cover and die to maintain a predetermined distance between the associated cover and die.
5. The method of claim 1 , further comprising:
cutting the microfeature workpiece to singulate the imaging dies; and
coupling the singulated dies to a support member.
6. The method of claim 5 , wherein the step of cutting the microfeature workpiece is performed before the step of attaching the covers to corresponding imaging dies.
7. The method of claim 5 , wherein the step of cutting the microfeature workpiece is performed subsequent to the step of attaching the covers to corresponding imaging dies.