Cryogenic insulation
View Patent ↗Putty-like gap-filling compounds for insulation that can be utilized at temperatures from about −420° F. (−250° C.) up to about 500° F. (260° C.) are described herein. Embodiments of these compounds contain about 25-50 volume percent base material, about 50-75 volume percent microspheres, and about 0.1-0.3 volume percent catalyst. Embodiments of these compounds contain about 70-80 weight percent base material, about 20-30 weight percent microspheres, and about 0.1-0.5 weight percent catalyst.
1. A liquid air insulation system comprising:
a plurality of foam insulation pieces substantially filling a predetermined area; and
a gap-filling compound filling predetermined gaps between adjacent foam insulation pieces and between foam insulation pieces and adjacent components,
wherein the gap filling compound comprises:
about 70-80 weight percent base material;
about 20-30 weight percent microspheres; and
about 0.1-0.5 weight percent catalyst,
wherein the gap-filling compound is capable of being utilized at temperatures from about −420° F. (−250° C.) up to about 500° F. (260° C.).
2. The liquid air insulation system of claim 1 , wherein the base material has a viscosity of about 5,000-10,000 poise.
3. The liquid air insulation system of claim 1 , wherein the gap-filling compound has a viscosity of about 500,000-1,000,000 poise after it is mixed and before it cures.
4. The liquid air insulation system of claim 1 , wherein the base material comprises a room temperature vulcanizing (RTV) silicone rubber compound based on at least one of poly(phenylmethyl)siloxane and poly(diphenyl)siloxane.
5. The liquid air insulation system of claim 1 , wherein the gap-filling compound further comprises at least one inert filler.
6. The liquid air insulation system of claim 5 , wherein the at least one inert filler comprises at least one of calcium carbonate, silicon dioxide, and zinc oxide.
7. The liquid air insulation system of claim 1 , wherein the base material comprises a glass transition temperature of about −150° F. (−101° C.) or below.
8. The liquid air insulation system of claim 1 , wherein the gap-filling compound comprises about 25-50 volume percent base material.
9. The liquid air insulation system of claim 1 , wherein the microspheres comprise at least one of: a glass, a ceramic, a phenolic, a polyiniide, an acrylic, a polyester, and combinations thereof.
10. The liquid air insulation system of claim 1 , wherein the microspheres comprise high purity silica microspheres comprising at least about 95 weight percent silica.
11. The liquid air insulation system of claim 1 , wherein the microspheres comprise an average diameter of about 10-100 microns.
12. The liquid air insulation system of claim 1 , wherein the microspheres are hollow.
13. The liquid air insulation system of claim 12 , wherein the microspheres comprise a wall thickness of about 1-2 microns.
14. The liquid air insulation system of claim 1 , wherein the microspheres comprise a density of about 0.1-0.3 g/cc.
15. The liquid air insulation system of claim 1 , comprising about 50-75 volume percent microspheres.
16. The liquid air insulation system of claim 1 , wherein the catalyst comprises at least one of dibutyl tin dilaurate and stannous tin octoate.
17. The liquid air insulation system of claim 1 , comprising about 0.1-0.3 volume percent catalyst.
18. The liquid air insulation system of claim 1 , wherein the system is used in at least one of: a cryogenic gas system, a cryogenic liquid system, a cryogenic gas production system, and a cryogenic liquid production system.
19. The liquid air insulation system of claim 1 , wherein the gap-filling compound comprises about 70-80 weight percent poly(phenylmethly)siloxane; about 20-30 weight percent high purity silica microspheres comprising at least about 95 weight percent silica; and about 0.1-0.5 weight percent dibutyl tin dilaurate.
20. A gap-filling compound comprising:
about 70-80 weight percent poly(phenylrnethyl)siloxane;
about 20-30 weight percent high purity silica microspheres comprising at least about 95 weight percent silica; and
about 0.1-0.5 weight percent dibutyl tin dilaurate.
21. The gap-filling compound of claim 20 , wherein the gap-filling compound is capable of operating at temperatures of about −420° F. (−250° C.) to about 500° F. (260° C.) and is used in at least one of: a liquid air insulation system, a cryogenic gas system, a cryogenic liquid system, a cryogenic gas production system, and a cryogenic liquid production system.
22. A liquid air insulation system comprising:
a plurality of foam insulation pieces substantially filling a predetermined area around a cryogenic fuel system;
a gap-filling compound filling predetermined gaps between adjacent foam insulation pieces and between foam insulation pieces and adjacent components of a cryogenic fuel system,
wherein the gap filling compound comprises:
about 70-80 weight percent base material;
about 20-30 weight percent microspheres; and
about 0.1-0.5 weight percent catalyst,
wherein the gap-filling compound is capable of being utilized at temperatures from about −420° F. (−250° C.) up to about 500° F. (260° C.).
23. The liquid air insulation system of claim 22 , wherein the gap-filling compound comprises about 70-80 weight percent poly(phenylmethyl)siloxane; about 20-30 weight percent high purity silica microspheres comprising at least about 95 weight percent silica; and about 0.1-0.5 weight percent dibutyl tin dilaurate.
24. A gap-filling compound comprising:
about 25-50 volume percent base material comprising a room temperature vulcanizing (RTV) silicone rubber compound based on at least one of poly(phenyhnethyl)siloxane and poly(diphenyl)siloxane;
about 50-75 volume percent microspheres; and
about 0.1-0.3 volume percent catalyst, wherein the gap-filling compound is capable of being utilized at temperatures from about −420° F. (−250° C.) up to about 500° F. (260° C.).
25. The gap-filling compound of claim 24 , wherein the microspheres comprise at least one of: a glass, a ceramic, a phenolic, a polyimide, an acrylic, a polyester, and combinations thereof.
26. The gap-filling compound of claim 24 , wherein the catalyst comprises at least one of dibutyl tin dilaurate and stannous tin octoate.