Electronic component module and manufacturing method thereof
View Patent ↗An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first transmission line 11 a and a high-frequency device 13 that is mounted on the first dielectric substrate 11 and is connected to the first transmission line 11 a. The antenna-side module B is equipped with a second dielectric substrate 12 that is laid on the first dielectric substrate 11 in such a manner that they are arranged in a lamination direction and that is formed with a second transmission line 12 a that is electrically connected to the first transmission line 11, and an antenna element 14 that is provided on the second dielectric substrate 12 and electrically connected to the high-frequency device 13 via the second transmission line 12 a and the first transmission line 11 a.
1. An electronic component module comprising:
a device-side module comprising:
a first dielectric substrate that is formed with a first transmission line; and
a plurality of high-frequency devices mounted on a first surface of the first dielectric substrate, at lease one of the plurality of high-frequency devices being connected to the first transmission line;
a shielding means which surrounds and electromagnetically shields the plurality of high-frequency devices individually; and
an antenna-side module comprising:
a second dielectric substrate that is laid on a second surface of the first dielectric substrate in such a manner that they are arranged in a lamination direction and that is formed with a second transmission line that is electrically connected to the first transmission line, the second surface being opposite to the first surface; and
an antenna element that is provided on the second dielectric substrate and electrically connected to the high-frequency device via the second transmission line and the first transmission line.
2. The electronic component module according to claim 1 , further comprising a third dielectric substrate that is formed with a through-hole in which the first dielectric substrate is inserted, mounted with a low-frequency functional component, fixed to the second dielectric substrate, and electrically connected to the first dielectric substrate.
3. The electronic component module according to claim 1 , wherein the first dielectric substrate is made of ceramics.
4. The electronic component module according to claim 1 , wherein the first dielectric substrate is made of low temperature co-fired ceramics.
5. The electronic component module according to claim 1 , wherein the second dielectric substrate is made of a resin.
6. The electronic component module according to claim 1 , wherein the first dielectric substrate is formed with a cavity and the high-frequency device is mounted in the cavity.
7. The electronic component module according to claim 1 , wherein the first dielectric substrate and the second dielectric substrate are laminated on each other.
8. The electronic component module according to claim 1 , wherein the shielding means comprises a shield layer that is formed on the first surface of the first dielectric substrate and a lid member that seals the high-frequency devices.
9. The electronic component module according to claim 1 , the high-frequency device is electrically connected to the first transmission line via a through-hole formed in the first dielectric substrate.
10. The electronic component module according to claim 1 , the antenna element is electrically connected to the second transmission line via a through-hole formed in the second dielectric substrate.