IP Library Granted Patent US 7,132,729
Granted Patent B2
US 7,132,729 · App. 10/929,475 · Granted Nov 7, 2006

Semiconductor device and method of manufacturing same

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Quick Facts
Patent No.
US 7,132,729
App. No.
10/929,475
Granted
Nov 7, 2006
Kind
B2
Abstract

The present invention provides a semiconductor device formed with a diode array together with bipolar transistors, which is capable of preventing the occurrence of crystal defects developed in cross patterns in deep trench regions and improving device yields, and a method of manufacturing the semiconductor device. A semiconductor device includes a LOCOS oxide film which isolates a plurality of diodes in an X direction, and deep trenches which isolate the plurality of diodes in a Y direction. The depth of each of the deep trenches is deeper than a high density layer embedded below a collector layer of each bipolar transistor. A shallow trench may be used as an alternative to the LOCOS oxide film.

Claims (6)

1. A semiconductor device formed with a diode array together with bipolar transistors, comprising:

at least one LOCOS oxide film which isolates one direction of the diode array; and

deep trenches which isolate a direction normal to the one direction of the diode array,

wherein the depth of each of the deep trenches is deeper than a high density layer embedded below a collector layer of the bipolar transistor.

2. A semiconductor device according to claim 1 , further comprising trenches each deeper than the high density layer, each of which connects between the deep trenches in such a manner that a connecting portion of the deep trenches takes a T type.

3. A semiconductor device according to claim 2 , wherein the trenches respectively connecting between the deep trenches in the T type are formed every adjacent two diodes, and an electrode electrically connected to the high density layer is formed between the two diodes.

Assignments (2)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
CHANGE OF NAME Recorded Dec 24, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022052/0797 →