Semiconductor device, a manufacturing method thereof, and a camera
View Patent ↗A semiconductor device includes a transfer channel for transferring charge generated by photoelectric conversion, an insulating film formed on the transfer channel, and a transfer electrode for applying a transfer voltage to the transfer channel via the insulating film. The insulating film has the first thickness and a second thickness that is thinner than the first thickness. The insulating film has the first thickness below both ends of the transfer electrode in a width direction of the transfer channel that is orthogonal to a charge transfer direction through the transfer channel, and the insulating film has the second thickness on a part including a center of the transfer channel in the width direction.
1. A semiconductor device comprising:
a transfer channel for transferring charge generated by photoelectric conversion;
a first insulating film formed on the transfer channel;
a second insulating film formed on the first insulating film; and
a transfer electrode for applying a transfer voltage to the transfer channel via the first and second insulating films, wherein
a first part of the second insulating film has a first thickness and a second part of second insulating film has a second thickness, the second thickness being thinner than the first thickness,
the first part of the second insulating film is located below both ends of the transfer electrode in a width direction of the transfer channel, the width direction being orthogonal to a charge transfer direction through the transfer channel,
the second part of the second insulating film is located on a center of the transfer channel in the width direction,
the first insulating film is a silicon oxide film, and
the second insulating film is thicker than the first insulating film.
2. The semiconductor device according to claim 1 ,
wherein the second part of the second insulating film has a width that is the same as a width of the transfer channel in the width direction.
3. The semiconductor device according to claim 2 ,
wherein the second insulating film is a silicon nitride film.
4. The semiconductor device according to claim 1 ,
wherein the second part of the second insulating film has a width that is wider than a width of the transfer channel and narrower than a width of the transfer electrode in the width direction.
5. The semiconductor device according to claim 1 ,
wherein the transfer electrode is an electrode adapted to have a readout voltage applied thereto, the readout voltage being a voltage for reading out the charge generated by photoelectric conversion to the transfer channel.
6. The semiconductor device according to claim 5 ,
wherein the second part of the second insulating film has a width that is wider than a width of the transfer channel and narrower than a width of the transfer electrode in the width direction.
7. The semiconductor device according to claim 1 ,
wherein the first part of the second insulating film is formed without reoxidizing the silicon oxide film.
8. A camera comprising a solid-state image sensor including a transfer channel for transferring charge generated by photoelectric conversion, a first insulating film formed on the transfer channel, a second insulating film formed on the first insulating film, and a transfer electrode for applying a transfer voltage to the transfer channel via the first and second insulating films, wherein
a first part of the second insulating film has a first thickness and a second part of the second insulating film has a second thickness, the second thickness being thinner than the first thickness,
the first part of the second insulating film is located below both ends of the transfer electrode in a width direction of the transfer channel, the width direction being orthogonal to a charge transfer direction through the transfer channel,
the second part of the second insulating film is located on a center of the transfer channel in the width direction,
the first insulating film is silicon oxide film, and
the second insulating film is thicker than the first insulating film.
9. A semiconductor device comprising:
a photoelectric conversion region on a semiconductor substrate;
an insulating portion on the semiconductor substrate; and
an electrode formed on the insulating portion, the electrode being adapted to have signal charge from the photoelectric conversion region read therefrom, wherein
a first part of the insulating portion has a first thickness and is located above the photoelectric conversion region,
a second part of the insulating portion has a second thickness and is located below a center part of the electrode, the second thickness being thinner than the first thickness,
the first part of the insulating portion comprises at least a silicon oxide film and another insulating film formed on the silicon oxide film, and
the other insulating film is thicker than the silicon oxide film.
10. The semiconductor device according to claim 9 ,
wherein the second part of the insulating portion comprises a silicon oxide and a silicon nitride.
11. The semiconductor device according to claim 9 ,
wherein the other insulating film is a silicon nitride film.
12. The semiconductor device according to claim 9 ,
wherein the first part of the insulating portion is formed without reoxidizing the silicon oxide film.
13. A camera comprising a solid-state image sensor including a photoelectric conversion region on a semiconductor substrate, an insulating portion on the semiconductor substrate, and an electrode formed on the insulating portion, the electrode being adapted to have signal charge from photoelectric conversion region read therefrom, wherein
a first part of the insulating portion has a first thickness and is located above the photoelectric conversion region,
a second part of the insulating portion has a second thickness and is located below a center part of the electrode, the second thickness being thinner than the first thickness,
the first part of the insulating portion comprises at least a silicon oxide film and another insulating film formed on the silicon oxide film, and
the other insulating film is thicker than the silicon oxide film.
14. The camera according to claim 13 ,
wherein the second part of the insulating portion comprises a silicon oxide and a silicon nitride.
15. The camera according to claim 13 ,
wherein the other insulating film is a silicon nitride film.