Method for pattern metalization of substrates
The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
1 ) A method for coupling a conductive element to a substrate, the method comprising the steps of
forming an adhesion layer on a portion of the first surface of the substrate; and
forming the conductive element on the adhesion layer to couple the conductive element to the substrate.
2 ) The method of claim 1 , further comprising the step of forming a mask of an electrophotographic imaging compound on the first surface of the substrate.
3 ) The method of claim 2 , further comprising the step of heating the substrate with the mask formed thereon to an elevated temperature for a selected period of time.
4 ) The method of claim 2 , further comprising the step of removing at least a portion of the mask from the first surface of the substrate.
5 ) The method of claim 1 , further comprising the step of affixing the substrate to a stiffener.
6 ) The method of claim 1 , further comprising the steps of
forming an adhesion layer on a portion of a second surface of the substrate; and
forming the conductive element on the adhesion layer formed on the second surface of the substrate.
7 ) The method of claim 6 , further comprising the step of forming a mask of an electrophotographic imaging compound on the second surface of the substrate.
8 ) The method of claim 7 , further comprising the step of heating the substrate with the mask formed thereon to an elevated temperature for a selected period of time.
9 ) The method of claim 7 , further comprising the step of removing at least a portion of the mask from the second surface of the substrate.
10 ) The method of claim 1 , further comprising the step of forming a dielectric layer on a portion of the first surface of the substrate.
11 ) The method of claim 10 , wherein the dielectric layer comprises silicon nitride (SiN x ).
12 ) The method of claim 10 , wherein the dielectric layer comprises silicon nitride (Si 3 N 4 ).
13 ) The method of claim 10 , wherein the dielectric layer comprises silicon dioxide (SiO 2 ).
14 ) The method of claim 10 , wherein the dielectric layer and the adhesion layer comprises a like material composition.
15 ) The method of claim 1 , further comprising the step of plasma etching at least the first surface of the substrate.
16 ) The method of claim 1 , wherein the substrate comprises glass.
17 ) The method of claim 1 , wherein the substrate comprises glass foil.
18 ) The method of claim 1 , wherein the substrate comprises silicon.
19 ) The method of claim 1 , wherein the substrate comprises a rigid substrate.
20 ) The method of claim 1 , wherein the substrate comprises a polymeric substrate.
21 ) The method of claim 20 , wherein the polymeric substrate comprises a flexible polymeric substrate.
22 ) The method of claim 21 , wherein the flexible polymeric substrate comprises a polyimide.
23 ) The method of claim 21 , wherein the flexible polymeric substrate comprises a polybenzimidazole.
24 ) The method of claim 21 , wherein the flexible polymeric substrate comprises a polyvinyl.
25 ) The method of claim 21 , wherein the flexible polymeric substrate comprises a polyester.
26 ) The method of claim 21 , wherein the flexible polymeric substrate comprises a polyacrylate.
27 ) The method of claim 21 , wherein the flexible polymeric substrate comprises a polyamide.
28 ) The method of claim 21 , wherein the flexible polymeric substrate comprises a celluloid.
29 ) The method of claim 1 , wherein the substrate comprises a fabric.
30 ) The method of claim 29 , wherein the fabric comprises a woven fabric.
31 ) The method of claim 1 , wherein the substrate comprises a lignocellulosic material.
32 ) The method of claim 1 , wherein the adhesion layer comprises an insulating material.
33 ) The method of claim 32 , wherein the insulating material comprises silicon dioxide (SiO 2 ).
34 ) The method of claim 32 , wherein the insulating material comprises silicon nitride (SiN x ).
35 ) The method of claim 1 , wherein the adhesion layer comprises at least one metalized layer.
36 ) The method of claim 35 , wherein the at least one metalized layer comprises titanium (Ti).
37 ) The method of claim 35 , wherein the at least one metalized layer comprises chromium (Cr).
38 ) The method of claim 35 , wherein the at least one metalized layer comprises copper (Cu).
39 ) The method of claim 35 , wherein the at least one metalized layer comprises aluminum (Al).
40 ) The method of claim 35 , wherein the at least one metalized layer comprises nickel (Ni).
41 ) The method of claim 1 , wherein the step of forming the adhesion layer comprises the step of depositing the adhesion layer with an electron beam evaporator.
42 ) The method of claim 1 , wherein the step of forming the adhesion layer comprises the step of depositing the adhesion layer using chemical vapor deposition.
43 ) The method of claim 1 , wherein the step of forming the adhesion layer comprises the step of depositing the adhesion layer using plasma enhanced chemical vapor deposition.
44 ) The method of claim 1 , wherein the step of forming the adhesion layer comprises the steps of
thermally evaporating a selected material; and
depositing the selected material on the portion of the first surface of the polymeric substrate.
45 ) The method of claim 1 , wherein the step of forming the adhesion layer comprises the step of plating the portion of the first surface of the substrate to form the adhesion layer.
46 ) The method of claim 45 , wherein the step of plating is performed with one or more electrodes.
47 ) The method of claim 45 , wherein the step of plating is performed in an electrodeless manner.
48 ) The method of claim 1 , wherein the step of forming the adhesion layer comprises the step of sputtering the portion of the first surface of the substrate to form the adhesion layer.
49 ) The method of claim 1 , wherein the step of forming the adhesion layer comprises the step of spraying a selected material on the portion of the first surface of the substrate to form the adhesion layer.
50 ) An electronic circuit comprising,
a substrate, and
an adhesion layer in contact with a portion of a first surface of the substrate, and
a conductive path in contact with a portion of the adhesion layer, the conductive path coupling a portion of a first electronic device of the electronic circuit to a portion of a second electronic device of the electronic circuit.
51 ) The electronic circuit of claim 50 , further comprising a dielectric layer in contact with a portion of the substrate and a portion of the adhesion layer.
52 ) The electronic circuit of claim 50 , further comprising
an adhesion layer in contact with a portion of a second surface of the substrate, and
a conductive path in contact with a portion of the adhesion layer in contact with the portion of the second surface of the substrate, the conductive path coupling a portion of a third electronic device of the electronic circuit to a portion of a fourth electronic device of the electronic circuit.
53 ) The electronic circuit of claim 50 , wherein the adhesion layer comprises a material having electrically conductive properties.
54 ) The electronic circuit of claim 50 , wherein the conductive path comprises a metalized layer.
55 ) The electronic circuit of claim 50 , wherein the substrate comprises a polymeric substrate.
56 ) The electronic circuit of claim 55 , wherein the polymeric substrate comprises a flexible polymeric substrate.
57 ) The electronic circuit of claim 50 , wherein the first electronic device comprises at least one of a transistor, a resistor, a capacitor, and an inductor.
58 ) An electronic circuit comprising,
a substrate, and
a via coupling a first conductive path in contact with a first adhesion layer formed on a first surface of the substrate to a second conductive path in contact with a second adhesion layer formed on a second surface of the substrate to couple the first conductive path to the second conductive path.
59 ) The electronic circuit of claim 58 , wherein at least one of the first adhesion layer and the second adhesion layer comprises a material having electrically conductive properties.
60 ) The electronic circuit of claim 58 , wherein at least one of the first conductive path and the second conductive path comprises a metalized layer.
61 ) The electronic circuit of claim 58 , wherein the substrate comprises a polymeric substrate.
62 ) The electronic circuit of claim 60 , wherein the polymeric substrate comprises a flexible polymeric substrate.
63 ) The electronic circuit of claim 60 , wherein the first conductive path couples a portion of a first electronic device to a second electronic device.
64 ) The electronic circuit of claim 63 , wherein the first electronic device comprises at least one of a transistor, a resistor, a capacitor, and an inductor.
65 ) The electronic circuit of claim 60 , wherein the second conductive path couples a portion of a third electronic device to a fourth electronic device.
66 ) The electronic circuit of claim 65 , wherein the third electronic device comprises at least one of a transistor, a resistor, a capacitor, and an inductor.
67 ) An electronic display, comprising
an electrophotgraphically imaged backplane,
an electrophoretic display medium coupled to the electrophotgraphically imaged backplane, and
a common electrode coupled to the electrophoretic display medium.
68 ) The electronic display of claim 67 , wherein the electrophotgraphically imaged backplane comprises,
a substrate,
an adhesion layer coupled to a surface of the substrate, and
a conductive element coupled to the adhesion layer.
69 ) The electronic display of claim 67 , wherein the electrophoretic display medium comprises, at least one of a bi-stable, non-volatile imaging material, a gyricon material, cholesteric material, a zenithal bi-stable device material, a thermo-chromic material, surface stabilized, ferroelectric liquid crystals, and an electrophoretic material having a plurality of portioned cells, each cell having a plurality of walls and an electrophoretic fluid filled therein.