IP Library Granted Patent US 7,126,232
Granted Patent B2
US 7,126,232 · App. 10/931,894 · Granted Oct 24, 2006

Defect repair apparatus for an electronic device

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Quick Facts
Patent No.
US 7,126,232
App. No.
10/931,894
Granted
Oct 24, 2006
Kind
B2
Abstract

A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD of other electronic device has defects. Described is a method of transferring a single or multi-layer thin film piece into a recess with the physical properties of the thin film piece unchanged. An electronic device is described incorporating a substrate; and a plurality of thin films laminated on the substrate and part of the thin films are formed on a predetermined circuit pattern, wherein a transfer film for repairing a defect is fitted into a recess where the low layers of the thin films are exposed by removing part of a single or multi-layer thin films covering a defective portion included on the thin films and its surrounding portion. Further, a method of repairing a defective portion included in the electronic device comprises the steps of: removing the thin films covering the defective portion and its surrounding portion to form a recess and exposing the lower layers of the thin films; and fitting a transfer film into the recess to attach the transfer film onto the exposed thin films.

Claims (8)

1. A defect repair apparatus for an electronic device comprising:

an ultrashort laser pulse generator for adjustably generating an ultrashort laser pulse;

a flexible mask pattern generator for forming an ultrashort laser pulse applied by said ultrashort laser pulse generator into a predetermined shape;

an optical system for converging said ultrashort laser pulse beam; and a first stage for positioning an electronic device to be repaired thereon;

a second stage for positioning a target plate thereon; and

a retention apparatus for maintaining a predetermined gap between said electronic device placed on said first stage and a target plate placed on said second stage.

2. The defect repair apparatus for an electronic device according to claim 1 , further comprising at least a cooling device for cooling said electronic device placed on said first stage.

3. The defect repair apparatus for an electronic device according to claim 1 , further comprising an apparatus for blowing an inert gas or a reductive gas into the clearance between said electronic device placed on said first stage and said target plate placed on said second stage, wherein said retention apparatus applies pressures onto said first stage and said second stage respectively, to bring them close to each other and maintain the predetermined gap by the balance of pressure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: AU OPTRONICS CORPORATION
Reel/Frame 017663/0854 →