IP Library Patent Application 10931974
Patent Application
App. No. 10/931,974

Plasma etcher

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Quick Facts
Patent No.
US None
App. No.
10/931,974
Abstract

A plasma etcher is provided, which includes: a chamber; top and bottom plasma electrodes provided top and bottom positions of the chamber; a gas injection pipe connected to the chamber; a plurality of diffusion plates provided between the top plasma electrode and the gate injection pipe; and a power generator supplying a plasma voltage to the top and bottom electrodes, wherein the top plasma electrode has a plurality of primary injection holes and the diffusion plates have a plurality of secondary injection holes.

Claims (10)

1 . A plasma etcher comprising:

a chamber;

top and bottom plasma electrodes provided top and bottom positions of the chamber;

a gas injection pipe connected to the chamber;

a plurality of diffusion plates provided between the top plasma electrode and the gate injection pipe; and

a power generator supplying a plasma voltage to the top and bottom electrodes,

wherein the top plasma electrode has a plurality of primary injection holes and the diffusion plates have a plurality of secondary injection holes.

2 . The plasma etcher of claim 1 , wherein the injection holes in the diffusion plates facing each other are alternately arranged.

3 . The plasma etcher of claim 2 , further comprising a temperature controller provided at the diffusion plates.

4 . The plasma etcher of claim 3 , further comprising a secondary diffusing plate provided at an inlet of the gate injection pipe.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028984/0774 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2004
From: CHOE, HEE-HWAN; KANG, SUNG-CHUL; KIM, SANG-GAB
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015771/0092 →