Integrated circuit module package and assembly method thereof
View Patent ↗An integrated circuit module package includes a lead frame having a recessed area. A semiconductor die containing active electrical components is attached to the recessed area of the lead frame. An integrated passive device containing passive electrical components is vertically stacked with, and electrically coupled to, the semiconductor die. An optional heat sink is attached to the integrated passive device. The integrated passive device is connected to the lead frame by conductors to electrically couple the integrated passive device and the semiconductor die to circuitry external to the integrated circuit module package. A cap is then attached to the heat sink or the integrated passive device to protect the semiconductor die and the integrated passive device. The integrated circuit module package dissipates heat from the semiconductor die through the lead frame, and dissipates heat from the integrated passive device through the cap and optional heat sink.
1. An integrated circuit module package for enclosing an integrated circuit module including a semiconductor die and an integrated passive device, the semiconductor die stacked with, and electrically coupled to the integrated passive device, the integrated circuit module package comprising:
a lead frame having a recessed area configured for receiving the semiconductor die, the lead frame having at least one coupling finger configured for establishing an electrical connection to the integrated passive device, wherein the semiconductor die comprises a first integrated circuit containing active electrical components disposed on a front surface of the semiconductor die, and the integrated passive device comprises a second integrated circuit comprising passive electrical components disposed on a front surface of the integrated passive device.
2. The integrated circuit module package of claim 1 , wherein the lead frame further includes a conductive lead.
3. The integrated circuit module package of claim 1 , wherein the integrated passive device is another semiconductor die.
4. The integrated circuit module package of claim 1 , further comprising a cap attached to the lead frame, the cap in combination with the lead frame forming an enclosure for the semiconductor die and the integrated passive device.
5. The integrated circuit module package of claim 1 , wherein the lead frame further comprises a conductive lead electrically coupled to the coupling finger.
6. The integrated circuit module package of claim 1 , further comprising a cap attached to the lead frame, the cap in combination with the lead frame forming an enclosure for the semiconductor die and the integrated passive device.
7. The integrated circuit module package of claim 1 , wherein the semiconductor die comprises a first integrated circuit containing active electrical components fabricated on a front surface of the semiconductor die, and the integrated passive device comprises a second integrated circuit containing passive electrical components fabricated on a front surface of the integrated passive device.
8. The integrated circuit module package of claim 7 , wherein the front surface of the semiconductor device faces the front surface of the integrated passive device.
9. A radio frequency module, comprising:
a semiconductor die including, on a front surface thereof, a first integrated circuit having a first contact pad;
an integrated passive device including, on a front surface thereof, a second integrated circuit having a second contact pad, the integrated passive device attached to the semiconductor die with the front surface of the semiconductor die facing the front surface of the integrated passive device; and
a conductor electrically coupled to the first contact pad and the second contact pad.
10. The radio frequency module of claim 9 , wherein the semiconductor die is composed of silicon.
11. The radio frequency module of claim 10 , wherein the integrated passive device is another semiconductor die.
12. The radio frequency module package of claim 11 , wherein the integrated passive device is composed of gallium arsenide.
13. The radio frequency module package of claim 9 , wherein the conductor is a stud bump.
14. The radio frequency module package of claim 9 , wherein the conductor is a solder bump.
15. The radio frequency module of claim 9 , wherein the conductor is an electroless bump.
16. The radio frequency module of claim 9 , wherein the first integrated circuit includes a third contact pad on the front surface of the semiconductor die and the second integrated circuit includes an electrode pad on the back surface of the integrated passive device, the integrated passive device further including a via containing a conductive material electrically coupled to the third contact pad and the electrode pad.
17. A radio frequency module package, comprising:
a lead frame;
a semiconductor die having a back surface attached to the lead frame and a front surface including a first integrated circuit having a first contact pad;
an integrated passive device having a front surface including a second integrated circuit having a second contact pad, the integrated passive device attached to the semiconductor die with the front surface of the integrated passive device facing the front surface of the semiconductor die; and
a first conductor electrically coupled to the first contact pad and the second contact pad.
18. The radio frequency module package of claim 17 , wherein the lead frame includes a recessed area, and the back surface of the semiconductor die is attached to the recessed area.
19. The radio frequency module package of claim 18 , wherein the back surface of the semiconductor die is attached to the lead frame with a conductive adhesive.
20. The radio frequency module package of claim 19 , wherein the conductive adhesive is a solder paste.
21. The radio frequency module package of claim 17 , further comprising a filler material between the front surface of the semiconductor die and the front surface of the integrated passive device.
22. The radio frequency module package of claim 21 , wherein the filler material is an electrically insulating material.
23. The radio frequency module package of claim 17 , further comprising a cap covering the semiconductor die and the integrated passive device.
24. The radio frequency module package of claim 23 , wherein the cap is a thermosetting material.
25. The radio frequency module package of claim 17 , wherein the lead frame includes a coupling finger.
26. The radio frequency module package of claim 25 , wherein the second integrated circuit includes a third contact pad on the front surface of the integrated passive device, the third contact pad electrically coupled to the coupling finger.
27. The radio frequency module package of claim 26 , wherein the third contact pad is electrically coupled to the coupling finger with a second conductor.
28. The radio frequency module package of claim 27 , wherein the third contact pad is electrically coupled to the coupling finger by a bonding wire.
29. The radio frequency module package of claim 27 , wherein the second integrated circuit includes a fourth contact pad on the front surface of the integrated passive device, the fourth contact pad electrically coupled to the lead frame by a third conductor.
30. The radio frequency module package of claim 25 , wherein the coupling finger is an external pin.
31. The radio frequency module package of claim 25 , wherein the first integrated circuit includes a third contact pad on the front surface of the semiconductor die, and the integrated passive device includes an electrode pad on the back surface of the integrated passive device, the third contact pad electrically coupled to the electrode pad through a via extending between the front surface of the integrated passive device and the back surface of the integrated passive device.
32. The radio frequency module package of claim 31 , further including a bonding wire electrically coupled to the electrode pad and the coupling finger.
33. The radio frequency module package of claim 17 , wherein the integrated passive device is another semiconductor die.
34. The radio frequency module package of claim 33 , wherein the semiconductor die is composed of silicon and the other semiconductor die is composed of gallium arsenide.
35. The radio frequency module package of claim 17 , wherein the first conductor is a stud bump, a solder bump, or an electroless bump.