Testing apparatus for carrying out inspection of a semiconductor device
View Patent ↗A method of manufacturing a semiconductor device has forming process for forming a semiconductor device on a major surface of a wafer, and testing process for testing defect of the semiconductor device. The testing process includes bringing a testing apparatus into contact with test electrodes of the semiconductor device. The testing apparatus has a contactor including probes that come into contact with the test electrodes of the semiconductor device, and secondary electrodes electrically connected to the probes and disposed on a surface opposite to the probes; and a substrate on which electrodes electrically communicated to the contactor by a conducting device. The conducting device is so formed that stress applied to the conducting device in the state where the probes are in contact with the test electrodes is larger than stress applied to the conducting device in the state where the probes are not in contact with the test electrodes.
1. A testing apparatus for carrying out inspection of a semiconductor device to be tested by coming into contact with test electrodes of the semiconductor device, comprising:
a plurality of contactor units having a plurality of contactors comprising a plurality of probes that come into contact with the test electrodes of the semiconductor device to be tested and secondary electrodes electrically connected to said probes and disposed on a surface opposite to said probes;
a substrate on which electrodes electrically communicated to said contactor units by a conducting device;
a contactor-supporting member for accommodating said plurality of contactor units and supporting said contactor units in a region containing circumferential ends of said contactor units; and
a supporting member to support said contactor-supporting member, the supporting member being separable from said contactor-supporting member,
wherein said testing apparatus being formed to allow positional variation between said contactor and said contactor-supporting member when said contactor units come into contact with said semiconductor device to be tested.
2. A testing apparatus according to claim 1 , wherein said conducting device includes a stress relaxation mechanism.
3. A testing apparatus according to claim 1 , wherein said contactor-supporting member supports said contactor units so that said contactor units are moveable substantially in a vertical direction.
4. A testing apparatus according to claim 1 , wherein said supporting member supports said contactor-supporting member so that said contactor-supporting member is moveable substantially in a vertical direction.