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App. No. 10/934,152 · Confirmation No. 6034

Method of controlling solder deposition utilizing two fluxes and preform

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2005-06-23 ABN Abandonment 2 View
2004-12-13 CTNF Non-Final Rejection 13 View
2004-12-13 892 List of references cited by examiner 1 View
2004-12-13 FOR Foreign Reference 12 View
2004-12-13 SRFW Search information including classification, databases and other search related notes 1 View
2004-12-13 BIB Bibliographic Data Sheet 1 View
2004-09-03 TRNA Transmittal of New Application 2 View
2004-09-03 SPEC Specification 27 View
2004-09-03 CLM Claims 7 View
2004-09-03 ABST Abstract 1 View
2004-09-03 DRW Drawings-only black and white line drawings 3 View
2004-09-03 OATH Oath or Declaration filed 5 View
2004-09-03 WFEE Fee Worksheet (SB06) 1 View
2004-09-03 WFEE Fee Worksheet (SB06) 1 View
2004-09-03 ADS Application Data Sheet 2 View
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Quick Facts
App. No.
10/934,152
Filed
2004-09-03
Pub. No.
US20050023328A1
Art Unit
1725