Method for mounting surface acoustic wave element and surface acoustic wave device having resin-sealed surface acoustic wave element
View Patent ↗A surface acoustic wave device that enables to reduce heating process, prevent from heat break, and make thin profile is to be provided. The surface acoustic wave device includes a substrate, a surface acoustic wave element having a comb electrode formed on a piezoelectric substrate, and being flip-mounted on the substrate using a bump in such a manner as the comb electrode is disposed opposite to the substrate, a first resin layer covering the surface acoustic wave element, and a second resin layer formed on the first resin layer, wherein the first resin layer and the second resin layer are thermosetting resins in which state transitions of being softened and thereafter cured are produced through heating process, and the first resin layer is formed of a resin material having greater fluidity caused by softening than the resin material of the second resin layer.
1. A surface acoustic wave device comprising:
a substrate;
a surface acoustic wave element having a comb electrode formed on a piezoelectric substrate, and being flip-mounted on the substrate using a bump in such a manner as the comb electrode is disposed opposite to the substrate;
a first resin layer covering the surface acoustic wave element; and
a second resin layer formed on the first resin layer,
wherein the first resin layer and the second resin layer are thermosetting resins in which state transitions of being softened and thereafter cured are produced through heating process, and
the first resin layer is formed of a resin material having greater fluidity caused by softening than the resin material of the second resin layer,
wherein the second resin layer includes a mold releasing agent added thereto, and the second resin layer is separated from the first resin layer after the state transitions in the first resin layer of being softened and thereafter cured are produced.
2. The surface acoustic wave device according to claim 1 , wherein the first resin layer is constituted of a resin material having a higher curing temperature than the resin material of the second resin layer.
3. A surface acoustic wave device comprising:
a substrate;
a surface acoustic wave element having a comb electrode formed on a piezoelectric substrate, and being flip-mounted on the substrate using a bump in such a manner as the comb electrode is disposed opposite to the substrate;
a heat-resistant laminating frame laminated on the substrate, and positioned so as to surround the surface acoustic wave element, wherein a height of the heat-resistant laminating frame is lower than a height of the surface acoustic wave element disposed opposite the substrate; and
a resin layer for covering the surface acoustic wave element,
wherein the resin layer is a thermosetting resin in which state transitions of being softened and thereafter cured are produced through heating process, and
the resin layer seals the comb electrode by adhering to the side faces of the surface acoustic wave element and the upper face of the laminating frame.
4. The surface acoustic wave device according to claim 3 , wherein at least a portion of the upper face of the laminating frame is metalized.
5. The surface acoustic wave device according to claim 3 , wherein either a glass coat or a metal coat is formed on the upper face of the laminating frame and the upper face of the surface acoustic wave element.