Aqueous slurry containing metallate-modified silica particles
Provided is a novel aqueous slurry composition for polishing/planarization of a substrate. The composition includes silicon dioxide abrasive particles wherein the abrasive particles are anionically modified/doped with metallate anions selected from the group consisting of aluminate, stannate, zincate and plumbate, thereby providing a high negative surface charge to the abrasive particles and enhances the stability of the slurry composition.
1 . An aqueous slurry composition for polishing/planarization of a substrate, comprising silicon dioxide abrasive particles wherein said abrasive particles are anionically modified/doped with metallate anions selected from the group consisting of aluminate, stannate, zincate and plumbate, thereby providing a high negative surface charge to said abrasive particles and enhancing the stability of said slurry composition.
2 . The aqueous slurry composition of claim 1 , wherein said metallate anions are aluminate anions (Al(OH) 4 − ).
3 . The aqueous slurry composition of claim 1 , wherein said silicon dioxide abrasive particles are colloidal.
4 . The aqueous slurry composition of claim 1 , wherein the modified/doped silica abrasive particles have a Zeta potential more negative than −10 mV.
5 . The stable aqueous slurry composition of claim 1 , wherein said slurry is acidic and said silicon dioxide abrasive particles are modified/doped with aluminate anions and their Zeta potential is more negative than −10 mV.
6 . The stable aqueous slurry composition of claim 1 , wherein the content of said silicon dioxide abrasive particles is in the range of about 0.01 to 50 weight percent.
7 . The stable aqueous slurry composition of claim 1 , wherein said slurry composition is employed in the chemical mechanical polishing/planarization of copper interconnect dual damascene structures.
8 . The stable aqueous slurry composition of claim 5 , wherein said slurry composition is employed in the chemical mechanical polishing/planarization of copper interconnect dual damascene structures.
9 . The stable aqueous slurry composition of claim 1 , wherein the size of said silicon dioxide abrasive particles is in the range of about 10 to 200 nm.
10 . An aqueous slurry composition for polishing/planarization of a metal film, comprising:
silicon dioxide abrasive particles wherein said abrasive particles are anionically modified/doped with metallate anions selected from the group consisting of aluminate, stannate, zincate and plumbate, thereby providing a high negative surface charge to said abrasive particles,
a corrosion inhibitor;
a chelating agent able to form water-soluble complexes with ions of a polished metal; and
an oxidizer, wherein said aqueous slurry composition is stable.
11 . The aqueous slurry composition of claim 10 , wherein said metallate anions are aluminate anions (Al(OH) 4 − ).
12 . The aqueous slurry composition of claim 10 , wherein the surface modified/doped silica abrasive particles have a Zeta potential more negative than −10 mV.
13 . The aqueous slurry composition of claim 10 , wherein said slurry is acidic and said silicon dioxide abrasive particles are modified/doped with aluminate anions and have a Zeta potential more negative than −10 mV.
14 . The aqueous slurry composition of claim 13 , wherein said silica abrasive particles are colloidal.
15 . The aqueous slurry composition of claim 10 , wherein said slurry has a pH of 6.0 or lower.
16 . The aqueous slurry composition of claim 14 , wherein said slurry has a pH of 6.0 or lower.
17 . The aqueous slurry composition of claim 10 , wherein said slurry has a pH of 4.0 or lower.
18 . The aqueous slurry composition of claim 14 , wherein said slurry has a pH of 4.0 or lower.
19 . The aqueous slurry composition of claim 10 , wherein the content of said silicon dioxide abrasive particles is in the range of about 0.01 to 50 weight percent.
20 . The aqueous slurry composition of claim 10 , wherein the content of said corrosion inhibitor is in the range of about 0.015 and 0.15 weight percent.
21 . The aqueous slurry composition of claim 10 , wherein the content of said chelating agent is in the range of about 0.05 and 5.0 weight percent.
22 . The aqueous slurry composition of claim 10 , wherein the content of said oxidizer is in the range of about 0.1 and 10 volume percent.
23 . The aqueous slurry composition of claim 10 , wherein said slurry solution is employed in the chemical mechanical polishing/planarization of copper interconnect dual damascene structures.
24 . The aqueous slurry composition of claim 10 , wherein said metal film is copper or a copper alloy, said corrosion inhibitor is selected from the group consisting of imidazole, triazole, benzimidazole, benzotriazole, derivatives and mixtures thereof, and said chelating agent is selected from the group consisting of aminoacids, carboxylic acids, their derivatives and salts.
25 . The aqueous slurry composition of claim 24 , wherein said slurry has a pH of 6.0 or lower.
26 . The aqueous slurry composition of claim 24 , wherein said slurry has a pH of 4.0 or lower, said silica abrasive particles are colloidal and have a Zeta potential more negative than −20 mV.
27 . The aqueous slurry composition of claim 26 , wherein said slurry is employed in the chemical mechanical polishing/planarization of copper interconnect dual damascene structures.
28 . The aqueous slurry composition of claim 10 , wherein the content of said silicon dioxide abrasive particles is in the range of about 0.03 to 5.0 weight percent.
29 . The aqueous slurry composition of claim 24 , wherein the content of said silicon dioxide abrasive particles is in the range of about 0.03 to 5.0 weight percent.