Methods of deep reactive ion etching
View Patent ↗A method of substantially simultaneously forming at least two fluid supply slots through a thickness of semiconductor substrate from a first surface to a second surface thereof. The method includes the steps of applying a photoresist layer to the first surface of the semiconductor substrate. The photoresist layer is patterned and developed using a gray scale mask for a first fluid supply slot. The semiconductor substrate is then reactive ion etched, to form the at least two fluid supply slots through the thickness of the substrate. The first fluid supply slot is substantially wider than the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.
1. A method of substantially simultaneously forming at least two fluid supply slots through a thickness of substrate from a first surface to a second surface thereof, comprising the steps of:
applying a photoresist layer to the first surface of the substrate;
patterning and developing the photoresist layer using a gray scale mask to provide a variable width through a thickness of the photoresist layer for forming a first fluid supply slot, and an essentially constant width through the thickness of the photoresist layer for forming a second fluid supply slot; and
reactive ion etching the substrate to form the at least two fluid supply slots through the thickness of the substrate, wherein a width of the first fluid supply slot is greater than a width of the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.
2. The method of claim 1 , wherein three or more fluid supply slots are etched through the thickness of the substrate, wherein the three or more supply slots each have widths that are less than the width of the first fluid supply slot.
3. The method of claim 1 , wherein the photoresist layer is a positive acting photoresist layer.
4. The method of claim 1 , wherein the photoresist layer is a negative acting photoresist layer.
5. The method of claim 1 , further comprising the steps of:
maintaining an amount of a first oxide layer on the first surface of the substrate for the first fluid supply slot; and
maintaining an amount of a second oxide layer less than the first oxide layer on the first surface of the semiconductor substrate for the second fluid supply slot prior to etching the slots through the thickness of the substrate.
6. A method of substantially simultaneously forming at least two fluid supply slots through a thickness of a substrate from a first surface to a second surface thereof, the method comprising the steps of:
providing a first layer of an oxide on the first surface of the substrate for a first fluid supply slot and a second layer of an oxide on the first surface of the substrate for a second fluid supply slot, wherein the first layer of oxide is thicker than the second layer of oxide;
applying a photoresist layer selected from positive and negative photoresist materials to the first surface of the substrate;
patterning and developing the photoresist layer using a mask for the first fluid supply slot and the second fluid supply slot; and
reactive ion etching the substrate to form the at least two fluid supply slots through the thickness of the substrate, wherein the first fluid supply slot is substantially wider than the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.
7. The method of claim 6 , wherein the steps are sequential.
8. The method of claim 6 , wherein three or more fluid supply slots are etched through the thickness of the substrate, wherein the three or more supply slots have widths that are substantially less than the width of the first fluid supply slot.
9. The method of claim 8 , wherein the photoresist layer is a positive acting photoresist layer.
10. The method of claim 8 , wherein the photoresist layer is a negative acting photoresist layer.