Method and apparatus for a stacked die configuration
A stacked die configuration for use in an IC package includes a first IC die mechanically coupled to a substrate material. Mechanically coupled to the first IC die is an interposer having an aperture adapted to receive a second IC die. Mechanically coupled to the first IC die and fitting within the aperture of the interposer is a second IC die. As a result, both the overall height of the IC package and the length of the bond wires connecting each of the members of the stacked die configuration may be reduced.
1 . A method of making an integrated circuit package comprising:
mechanically coupling a first integrated circuit die to a substrate material;
mechanically coupling a second integrated circuit die of a smaller size than the first integrated circuit die to the first integrated circuit die; and
mechanically coupling an interposer, having an aperture adapted to receive the second integrated circuit die, to the first integrated circuit die.
2 . The method of claim 1 further comprising:
obtaining a wafer that contains a plurality of integrated circuit dies;
separating each of the plurality of integrated circuit dies from the wafer into at least the first integrated circuit die and the second integrated circuit die.
3 . The method of claim 1 further comprising:
wire bonding electrical contact pad surfaces of the first integrated circuit die to electrical contact pad surfaces of the substrate material;
wire bonding electrical contact pad surfaces of the interposer to electrical contact pad surfaces of the first integrated circuit die; and
wire bonding electrical contact pad surfaces of the second integrated circuit die to electrical contact pad surfaces of the interposer.
4 . The method of claim 1 , wherein the method of mechanically coupling the first integrated circuit die to the substrate material includes applying a die adhesive to at least one of the first integrated circuit die and the substrate material.
5 . The method of claim 1 , wherein the method of mechanically coupling the second integrated circuit die to the first integrated circuit die includes applying a die adhesive to at least one of the second integrated circuit die and the first integrated circuit die.
6 . The method of claim 1 , wherein the method of mechanically coupling the second integrated circuit die to the interposer includes applying a die adhesive to at least one of the second integrated circuit die and the interposer.
7 . The method of claim 1 , wherein the height of the interposer is greater than or equal to the height of the second integrated circuit die.
8 . An integrated circuit package made by the process of at least:
mechanically coupling a first integrated circuit die to a substrate material;
mechanically coupling a second integrated circuit die of a smaller size than the first integrated circuit die to the first integrated circuit die; and
mechanically coupling an interposer, having an aperture adapted to receive the second integrated circuit die, to the first integrated circuit die.
9 . The integrated circuit package of claim 8 further made by the process of:
wire bonding electrical contact pad surfaces of the first integrated circuit die to electrical contact pad surfaces of the substrate material;
wire bonding electrical contact pad surfaces of the interposer to electrical contact pad surfaces of the first integrated circuit die; and
wire bonding electrical contact pad surfaces of the second integrated circuit die to electrical contact pad surfaces of the interposer.
10 . The integrated circuit package of claim 8 , wherein the method of mechanically coupling the first integrated circuit die to the substrate material includes applying a die adhesive to at least one of the first integrated circuit die and the substrate material.
11 . The integrated circuit package of claim 8 , wherein the method of mechanically coupling the second integrated circuit die to the first integrated circuit die includes applying a die adhesive to at least one of the second integrated circuit die and the first integrated circuit die.
12 . The integrated circuit package of claim 8 , wherein the method of mechanically coupling the second integrated circuit die to the interposer includes applying a die adhesive to at least one of the second integrated circuit die and the interposer.
13 . The integrated circuit package of claim 8 , wherein the height of the interposer is greater than or equal to the height of the second integrated circuit die.
14 . An integrated circuit package comprising:
a first integrated circuit die mechanically coupled to a substrate material;
a second integrated circuit die, having a smaller size than the first integrated circuit die, mechanically coupled to the first integrated circuit die;
an interposer, having an aperture adapted to receive the second integrated circuit die, mechanically coupled to the first integrated circuit die.
15 . The integrated circuit package of claim 14 further comprising:
electrical contact pad surfaces of the first integrated circuit die wire bonded to electrical contact pad surfaces of the substrate material;
electrical contact pad surfaces of the interposer wire bonded to electrical contact pad surfaces of the first integrated circuit die; and
electrical contact pad surfaces of the second integrated circuit die wire bonded to electrical contact pad surfaces of the interposer.
16 . An interposer for an integrated circuit package comprising:
a substrate frame portion defining an opening adapted to receive an integrated circuit die having at least one electrical contact pad surface located on a top surface of the integrated circuit die; and
at least one electrical contact pad surface located on a top surface of the substrate frame portion.
17 . The interposer of claim 16 , wherein the substrate frame portion includes at least four walls that define the opening.
18 . The interposer of claim 16 , wherein the opening corresponds in shape to a shape of the integrated circuit die.
19 . The interposer of claim 16 , wherein at least one electrical contact pad surface of the integrated circuit die is wire bonded to at least one electrical contact pad surface of the interposer.
20 . An interposer for an integrated circuit package comprising:
a substrate frame portion defining an opening adapted to receive an integrated circuit die; and
at least one pair of electrical contact pad surfaces located on a top surface of the substrate frame portion, wherein each of the at least one pair of electrical contact pad surfaces comprises a first electrical contact pad surface operatively coupled to a second electrical contact pad surface.
21 . The interposer of claim 20 , wherein each first electrical contact pad surface is wire bonded to a electrical contact pad surface located on a top surface of the integrated circuit die, and wherein each second electrical contact pad surface is wire bonded to a electrical contact pad surface of a second integrated circuit.