Multiprocessor system having a shared tightly coupled memory and method for communication between a plurality of processors
View Patent ↗A multiprocessor system comprises a first processor (P 1 ) and a second processor (P 2 ) each having an input/output set up for the connection of a tightly coupled semiconductor memory. Furthermore, the multiprocessor system comprises a shared tightly coupled integrated semiconductor memory ( 101 ), which can be accessed by both processors (P 1 , P 2 ) via their input/output.
1. A chip-integrated multiprocessor system comprising:
a first processor and a second processor each having an input/output set up for the connection of a tightly coupled semiconductor memory, and
a shared tightly coupled integrated semiconductor memory, which can be accessed by both the first and second processors via their input/output.
2. The chip-integrated multiprocessor system according to claim 1 , wherein the first and second processors each have an address generating unit which is assigned to the input/output and realises the address generation for accessing the shared tightly coupled semiconductor memory.
3. The chip-integrated multiprocessor system according to claim 1 , wherein the address generation for accessing the shared tightly coupled semiconductor memory is a DMA address generating unit assigned to the input/output of the first and/or the second processor.
4. The chip-integrated multiprocessor system according to claim 2 , wherein the address generation for accessing the shared tightly coupled semiconductor memory is a DMA address generating unit assigned to the input/output of the first and/or the second processor.
5. The chip-integrated multiprocessor system according to claim 1 , wherein a compression/decompression module is arranged between the input/output of the first and/or the second processor and the shared tightly coupled semiconductor memory.
6. The chip-integrated multiprocessor system according to claim 1 , wherein an encryption/decryption module is arranged between the input/output of the first and/or the second processor and the shared tightly coupled semiconductor memory.
7. The chip-integrated multiprocessor system according to claim 1 , wherein one or a plurality of buffer memories are arranged between the input/output of the first and/or the second processor and the shared tightly coupled semiconductor memory.
8. The chip-integrated multiprocessor system according to claim 1 , wherein the shared tightly coupled semiconductor memory has one or a plurality of private memory areas which can be accessed in each case by only a single processor.
9. The chip-integrated multiprocessor system according to claim 1 , wherein the shared tightly coupled semiconductor memory is a two-port memory.
10. The chip-integrated multiprocessor system according to claim 1 , wherein the shared tightly coupled semiconductor memory is assigned a semiconductor memory expansion, in particular an SRAM memory, which can be accessed by the first and second processors via the inputs/outputs.
11. The chip-integrated multiprocessor system according to claim 1 , wherein one processor is a digital signal processor and the other processor is a RISC microprocessor.
12. The chip-integrated multiprocessor system according to claim 1 , wherein the first and second processors each have further inputs/outputs which are connected by a bus architecture to a further shared memory.
13. A method for communication between two processors of a chip-integrated multiprocessor system which each has an input/output for accessing a shared tightly coupled semiconductor memory comprising the steps of:
writing data and/or instructions to the shared tightly coupled semiconductor memory by the first processor; and
reading by the second processor the data and/or instructions that have been written to the shared tightly coupled semiconductor memory by the first processor.
14. The method according to claim 13 , comprising the following steps:
compressing and/or encrypting the data and/or instructions that have been output by the first processor by means of a compression and/or encryption circuit;
writing the compressed and/or encrypted data and/or instructions to the shared tightly coupled semiconductor memory;
decompressing and/or decrypting the data/or instructions that are to be read from the shared tightly coupled semiconductor memory by the second processor using a decompression and/or decryption circuit; and
reading the decompressed and/or decrypted data and/or instructions by the second processor.
15. The method according to claim 13 , comprising the following steps:
temporarily storing data and/or instructions that are to be read from the shared tightly coupled semiconductor memory or are to be written to the shared tightly coupled semiconductor memory in at least one buffer memory.
16. The method according to claim 14 , comprising the following steps:
temporarily storing data and/or instructions that are to be read from the shared tightly coupled semiconductor memory or are to be written to the shared tightly coupled semiconductor memory in at least one buffer memory.
17. The method according to claim 13 , comprising the following steps:
storing data and/or instructions in an expansion memory assigned to the tightly coupled shared semiconductor memory by the first and/or the second processor.
18. A chip-integrated multiprocessor system comprising:
a first processor and a second processor each having an input/output set up for the connection of a tightly coupled semiconductor memory,
a shared tightly coupled integrated semiconductor memory coupled with said first and second processor, which can be accessed by both the first and second processors via their input/output, wherein the shared tightly coupled semiconductor memory has one or a plurality of private memory areas which can be accessed in each case by only a single processor, and
a processing module arranged between the input/output of the first and/or the second processor and the shared tightly coupled semiconductor memory.
19. The chip-integrated multiprocessor system according to claim 18 , wherein the first and second processors each have an address generating unit which is assigned to the input/output and realises the address generation for accessing the shared tightly coupled semiconductor memory.
20. The chip-integrated multiprocessor system according to claim 18 , wherein the address generation for accessing the shared tightly coupled semiconductor memory is a DMA address generating unit assigned to the input/output of the first and/or the second processor.
21. The chip-integrated multiprocessor system according to claim 18 , wherein the processing module is a compression/decompression module or an encryption/decryption module.
22. The chip-integrated multiprocessor system according to claim 18 , wherein one or a plurality of buffer memories are arranged between the input/output of the first and/or the second processor and the shared tightly coupled semiconductor memory.
23. The chip-integrated multiprocessor system according to claim 18 , wherein the shared tightly coupled semiconductor memory is a two-port memory.
24. The chip-integrated multiprocessor system according to claim 18 , wherein the shared tightly coupled semiconductor memory is assigned a semiconductor memory expansion, in particular an SRAM memory, which can be accessed by the first and second processors via the inputs/outputs.
25. The chip-integrated multiprocessor system according to claim 18 , wherein one processor is a digital signal processor and the other processor is a RISC microprocessor.
26. The chip-integrated multiprocessor system according to claim 18 , wherein the first and second processors each have further inputs/outputs which are connected by a bus architecture to a further shared memory.