IP Library Granted Patent US 7,081,019
Granted Patent B2
US 7,081,019 · App. 10/941,469 · Granted Jul 25, 2006

Low profile contact block for a rechargeable cell of a wireless communication device

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Quick Facts
Patent No.
US 7,081,019
App. No.
10/941,469
Granted
Jul 25, 2006
Kind
B2
Abstract

A low-profile, insert molded contact block and corresponding printed circuit board assembly are provided for coupling electronic circuitry disposed on printed wiring boards to external electronic devices. The contact block includes a plurality of L-shaped, metal contacts insert molded into a housing. The housing includes bracing members that circumscribe the metal contacts so that at least a portion of the front and rear faces of the metal contacts are exposed between the bracing members. The contact block may be coupled to a printed wiring board in an automated, reflow solder process utilizing automated pick and place equipment. The contact block is placed on the printed wiring board such that the metal contacts are seated on conductive pads with solder paste disposed thereon. The resulting assembly may then be heated in a reflow oven to permanently affix the metal contacts to the conductive pads. The contact block, which can be on the order of 0.6 millimeters thick, can significantly reduce the overall size of the host electronic device.

Claims (13)

1. A printed circuit board assembly, comprising:

a. a printed wiring board having electrically conductive pads and traces thereon, the printed wiring board having at least one face and at least one edge;

b. a L-shaped contact block coupled to the board such that a first side of the L-shaped contact block is substantially perpendicular to the at least one face and extends over the at least one edge, and the second side of the L-shaped contact block is substantially parallel to the at least one face;

wherein the L-shaped contact block comprises a plurality of L-shaped electrically conductive contacts, and wherein the plurality of L-shaped electrically conductive contacts are electrically coupled to the electrically conductive pads by soldering.

2. The contact block of claim 1 , wherein the L-shaped contact block has a thickness of less than three-quarters of a centimeter.

3. The contact block of claim 1 , wherein the first side of the L-shaped cross section has a length of less than three and a half millimeters.

4. The contact block of claim 3 , wherein the second side has a length of less than five and a half millimeters.

5. The assembly of 1 , wherein the plurality of L-shaped electrically conductive contacts are electrically coupled to a plurality of electrically conductive pads on the printed wiring board.

6. The assembly of 5 , wherein the electrical coupling of the plurality of L-shaped electrically conductive contacts and the plurality of electrically conductive pads is accomplished by reflow soldering.

7. An electronic device having a printed circuit board assembly, comprising:

a. a printed wiring board having electrically conductive pads and traces thereon, the printed wiring board having at least one face and at least one edge;

b. a L-shaped contact block coupled to the board such that a first side of the L-shaped contact block is substantially perpendicular to the at least one face and extends over the at least one edge, and the second side of the L-shaped contact block is substantially parallel to the at least one face, wherein the L-shaped contact block comprises a plurality of L-shaped electrically conductive contacts; and

c. at least one rechargeable cell that electrically couples to the printed wiring board.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2018
From: GOOGLE TECHNOLOGY HOLDINGS LLC
To: AMPEREX TECHNOLOGY LIMITED
Reel/Frame 046392/0764 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2014
From: MOTOROLA MOBILITY LLC
To: GOOGLE TECHNOLOGY HOLDINGS LLC
Reel/Frame 034517/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2014
From: HO, SUANG TIEN; CHUNG, SOON CHENG; TAN, WILING
To: MOTOROLA, INC
Reel/Frame 033558/0559 →
CHANGE OF NAME Recorded Oct 2, 2012
From: MOTOROLA MOBILITY, INC.
To: MOTOROLA MOBILITY LLC
Reel/Frame 029216/0282 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 13, 2010
From: MOTOROLA, INC
To: MOTOROLA MOBILITY, INC
Reel/Frame 025673/0558 →