Image sensor and method for manufacturing the same
View Patent ↗The present invention discloses an image sensor and a method for manufacturing the same which is capable of increasing the light-collection efficiency of a photodiode. The image sensor comprises: at least one photodiode formed on a semiconductor substrate; multilayer interlayer insulating films formed on the photodiode and stacked in at least two layers so that the density of the upper interlayer insulating film becomes lower than that of the lower interlayer insulating film as the multilayer interlayer insulating films proceed upward; a light shield layer and an element-protecting film sequentially stacked on the multilayer interlayer insulating film; color filter arrays and a flattening layer sequentially stacked on the element-protecting film; and microlenses arranged on the positions corresponding to the color filters on the flattening layer. Therefore, the light-collection efficiency of the photodiode can be increased with an increased transmittance of a vertical light reaching to the photodiode by making the multilayer interlayer insulating films have a lower density as they proceed upward to decrease the refraction angle of the incident light penetrated through the microlenses and color filters.
1. An image sensor, comprising:
at least one photodiode formed on a semiconductor substrate;
multi-layer interlayer insulating films formed on the photodiode and stacked in at least two layers of oxide film having different density and the refractive index so that the density and the refractive index of the upper interlayer insulating film becomes lower than that of the lower interlayer insulating film as the multi-layer interlayer insulating films proceed upward;
a light shield layer and an element-protecting film sequentially stacked on the multi-layer interlayer insulating film;
color filter arrays and a flattening layer sequentially stacked on the element-protecting film; and
microlenses arranged on the positions corresponding to the color filters on the flattening layer.
2. The image sensor of claim 1 , wherein the density of the oxide films becomes higher in the order of PE-CVD<HDP-CVD<LP-CVD<thermal oxidations.
3. The image sensor of claim 1 , multi-layer wiring is vertically formed on the multi-layer interlayer insulating films, the element-protecting film and the flattening layer.
4. The image sensor of claim 1 , further comprising a photosensitivity adjusting film formed below the multi-layer interlayer insulating films.
5. The image sensor of claim 4 , further comprising a buffer insulating film formed below the photosensitivity adjusting film.
6. A method for manufacturing an image sensor, comprising the steps of:
making at least one photodiode on a semiconductor substrate;
forming on the photodiode multi-layer interlayer insulating films stacked in at least two layers of oxide film having different density and the refractive index so that the density and the refractive index of the upper interlayer insulating film becomes lower than that of the lower interlayer insulating film as the multi-layer interlayer insulating films proceed upward;
forming a light shield layer and an element-protecting film sequentially stacked on the multi-layer interlayer insulating film;
forming color filter arrays and a flattening layer sequentially stacked on the element-protecting film; and
forming microlenses arranged on the positions corresponding to the color filters on the flattening layer.
7. The method of claim 6 , wherein the density of the oxide films becomes higher in the order of PE-CVD<HDP-CVD<LP-CVD<thermal oxidation.
8. The method of claim 7 , wherein the density of the upper interlayer insulating film becomes lower than that of the lower interlayer insulating film by adjusting the deposition process, the deposition temperature and the concentration of impurities doped on the interlayer insulating films.
9. The method of claim 6 , wherein the multi-layer interlayer insulating films are formed of oxides and the density is lowered by making the concentration of impurities to be doped higher in the upper interlayer insulating film than in the lower interlayer insulating film.
10. The method of claim 6 , further comprising the step of forming multi-layer wiring in the step of forming the multi-layer interlayer insulating films, the element-protecting film and the flattening layer.
11. The method of claim 6 , further comprising the step of forming a photosensitivity adjusting film below the multi-layer interlayer insulating films.
12. The method of claim 11 , further comprising the step of forming a buffer insulating film below the photosensitivity adjusting film.