Image sensor module and camera module package including the same
View Patent ↗A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.
1. An image sensor module comprising:
an image sensing device unit that comprises an image sensing device and a pixel area part;
a device connecting pad formed on a surface of the image sensing device;
a circuit board that comprises at least one hole corresponding to a location of the pixel area part and at least one other hole corresponding to a location of the device connecting pad;
a board connecting pad; and
a connecting unit for connecting the device connecting pad and the board connecting pad,
wherein the board connecting pad is attached to one surface of the circuit board and the image sensing device unit is attached to the opposite surface of the circuit board.
2. The image sensor module of claim 1 , wherein the pixel area part is formed on a surface of the image sensing device.
3. The image sensor module of claim 1 , wherein the pixel area part collects light images to be photographed.
4. The image sensor module of claim 1 , wherein the device connecting pad assists in forming an electrical connection to an external device.
5. The image sensor module of claim 1 , wherein the image sensing device unit is attached to the circuit board so that the image sensing device is attached to the circuit board.
6. The image sensor module of claim 1 , wherein the connecting unit is a bonding wire for connecting the circuit board and the image sensing device unit in a wire bonding method.
7. The image sensor module of claim 6 , wherein the device connecting pad is exposed through the at least one other hole such that the bonding wire directly connects to the device connecting pad.
8. The image sensor module of claim 1 , wherein the perimeter of the image sensing device unit does not extend beyond the surface of the circuit board that is opposite to the surface to which the image sensing device unit is attached.
9. The image sensor module of claim 7 , wherein the pixel area part is formed on a surface of the image sensing device.
10. A camera module package comprising:
an image sensing device unit that comprises an image sensing device and a pixel area part;
a device connecting pad formed on a surface of the image sensing device;
a circuit board that comprises at least one hole corresponding to a location of the pixel area part and at least one other hole corresponding to a location of the device connecting pad;
a board connecting pad;
a housing attached to the circuit board; and
a connecting unit for connecting the device connecting pad and the board connecting pad,
wherein the board connecting pad is attached to one surface of the circuit board and the image sensing device unit is attached to the opposite surface of the circuit board.
11. The camera module package of claim 10 , wherein the housing maintains an airtight status for the module.
12. The camera module package of claim 10 , wherein the housing comprises a lens barrel unit for passing through light images collected from outside the module.
13. The camera module package of claim 12 , wherein the housing comprises a cover installed on an outer end portion of the lens barrel unit.
14. The camera module package of claim 12 , wherein the housing comprises an infrared ray and reflection prevention filter installed at an inner end portion of the lens barrel unit near the pixel area part, for shielding against infrared rays and preventing light induced into the image sensing device unit from being reflected.
15. The camera module package of claim 12 , wherein the housing comprises a lens being mounted in the lens barrel unit so as to be moved along threads that are formed on the inner surface of the lens barrel unit.
16. The camera module package of claim 10 , wherein the pixel area part is formed on a surface of the image sensing device.
17. The camera module package of claim 10 , wherein the pixel area part collects light images to be photographed.
18. The camera module package of claim 10 , wherein the device connecting pad assists in forming an electrical connection to an external device.
19. The camera module package of claim 10 , wherein the image sensing device unit is attached to the circuit board so that the image sensing device is attached to the circuit board.
20. The camera module package of claim 10 , wherein the connecting unit is a bonding wire for connecting the circuit board and the image sensing device unit in a wire bonding method.
21. The camera module package of claim 20 , wherein the device connecting pad is exposed through the at least one other hole such that the bonding wire directly connects to the device connecting pad.
22. The camera module package of claim 10 , wherein the perimeter of the image sensing device unit does not extend beyond the surface of the circuit board that is opposite to the surface to which the image sensing device unit is attached.
23. The camera module package of claim 22 , wherein the pixel area part is formed on a surface of the image sensing device.
24. The camera module package of claim 10 , wherein the housing, the at least one hole in the circuit board, and the pixel area part are lined up so that light may pass through the housing and the at least one hole and contact the pixel area part.
25. An image obtaining apparatus comprising a camera module package that comprises:
an image sensing device unit that comprises an image sensing device and a pixel area part;
a device connecting pad formed on a surface of the image sensing device;
a circuit board that comprises at least one hole corresponding to a location of the pixel area part and at least one hole corresponding to a location of the device connecting pad;
a board connecting pad;
a housing attached to the circuit board; and
a connecting unit for connecting the device connecting pad and the board connecting pad,
wherein the board connecting pad is attached to one surface of the circuit board and the image sensing device unit is attached to the opposite surface of the circuit board.
26. The image obtaining apparatus of claim 25 , wherein the connecting unit is a bonding wire for connecting the circuit board and the image sensing device unit in a wire bonding method.
27. The image obtaining apparatus of claim 26 , wherein the device connecting pad is exposed through the at least one other hole such that the bonding wire directly connects to the device connecting pad.