Electrically isolated and thermally conductive double-sided pre-packaged component
View Patent ↗An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper material are directly bonded to the inner and outer surfaces of the substrate members.
1. A pre-packaged component device comprising:
a first non-conductive substrate member having an outer surface;
a second non-conductive substrate member having an outer surface, said first and second substrate members being formed from a ceramic material and disposed in a spaced, substantially parallel relationship, with said surfaces opposing one another;
a first layer of solderable electrically conductive copper material direct bonded to the outer surface of said first substrate member;
a second layer of solderable electrically conductive copper material direct bonded to the outer surface of said second substrate member;
lead members and a metal oxide semiconductor field effect transistor (MOSFET) positioned between said first and second non-conductive substrate members, said MOSFET having at least one gate, said lead members stamped from copper material during manufacture and comprising a gate pin, a drain member and a source member;
a drain pad positioned on an inside surface of said first non-conductive substrate member facing said second non-conductive substrate member;
a source pad and a gate runner positioned on an inside surface of said second non-conductive substrate member facing said first non-conductive substrate member.
2. The component device as recited in claim 1 wherein said component device is a high current, high power device.
3. The component device as recited in claim 1 wherein said component device is a power diode with no gate lead.
4. The component device as recited in claim 1 wherein said component devices carry higher current densities than conventional devices.
5. The component device as recited in claim 1 wherein said ceramic material is taken from the group consisting of alumina, aluminum nitride, silicon nitride, and beryllium oxide.