Hermetically sealed microdevice with getter shield
View Patent ↗A microdevice that comprises a device microstructure ( 38 ) and vent channel ( 34 ) in a wafer ( 14 ) that is sandwiched between a substrate ( 10 ) and a cap ( 16 ). The cap ( 16 ) and substrate ( 10 ) have recesses ( 41, 21 ) around the microstructure ( 22 ) to define a cavity. A vent ( 25 ) is connected to the vent channel ( 34 ) and subsequently to the cavity. The vent ( 25 ) is used to evacuate and seal the microstructure ( 38 ) in the cavity. A getter layer ( 32 ) can be used to maintain the cavity vacuum. An electrical connection can be provided through the vent ( 25 ), vent channel ( 34 ) and cavity to the getter ( 32 ) to electrically ground the getter layer ( 32 ).
1. A method of making a hermetically sealed microdevice, the method comprising the steps of:
providing a substrate with a recess therein;
providing a cap with a recess therein;
defining a microstructure and a vent channel in a silicon layer, the vent channel configured to couple to the recesses after the bonding step;
forming a vent, the vent configured to couple to the vent channel after the bonding step;
disposing a getter layer in at least one of the recesses;
bonding the cap, silicon wafer, and substrate together such that the recesses in the cap and substrate form a cavity to enclose the microstructure, and wherein the vent, vent channel and cavity are coupled together;
evacuating the cavity through the vent and vent channel; and
sealing the vent to provide a hermetically sealed cavity enclosing the microstructure.
2. The method of claim 1 , further comprising the step of providing an electrical connection through the vent and cavity to the getter layer to electrically ground the getter layer.
3. The method of claim 1 , wherein the step of defining includes patterning and etching the silicon wafer to provide the microstructure and vent channel.
4. The method of claim 1 , wherein the sealing step includes solder sealing the vent.
5. The method of claim 1 , wherein the step of disposing the getter layer includes disposing a three layer composite getter layer consisting of a shield layer, a getter layer, and a protection layer.
6. The method of claim 1 , wherein the step of bonding includes anodic bonding of the cap, silicon layer and substrate to form a microdevice assembly.
7. The method of claim 1 , wherein the bonding step includes wafer level bonding of multiple microdevices.
8. The method of claim 1 , wherein the forming step includes forming the vent in the substrate.
9. The method of claim 1 , wherein the forming step includes forming the vent in the cap.
10. A method of making a hermetically sealed microdevice, the method comprising the steps of:
providing a substrate with a recess therein;
providing a cap with a recess therein;
defining a microstructure and a vent channel in a silicon wafer, the vent channel configured to couple to the recesses after the bonding step;
forming a vent the vent configured to couple to the vent channel after the bonding step;
disposing metal interconnects;
mounting the silicon wafer to the substrate;
disposing a composite thin metal film getter in the recess of the cap and providing for a ground connection thereto;
anodic bonding the cap to the silicon wafer such that the recess in the cap forms a cavity to enclose the microstructure and the vent is aligned with the vent channel, and the vent, vent channel and cavity are coupled together;
evacuating the cavity through the vent and vent channel; and
sealing the vent with solder to provide a hermetically sealed cavity enclosing the microstructure and to provide an external electrical ground connection to the getter layer.
11. The method of claim 10 , wherein the composite thin metal film getter of the composing step consists of three layers: an electrical shield and outgassing block layer facing to the cap recess, a getter layer, and an outermost anti-oxidation layer.
12. The method of claim 10 , wherein the step of anodic bonding includes anodic bonding the microdevice wafer to the substrate such that the microdevice wafer is sandwiched between the cap and substrate.
13. The method of claim 10 , wherein the forming step includes forming the vent in the substrate.
14. The method of claim 10 , wherein the forming step includes forming the vent in the cap.