Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
View Patent ↗In one aspect, a signal path is described. The signal path has a nominal impedance over a specified bandwidth and interconnects a port of a microwave circuit package and a microwave component mounted in the microwave circuit package. The signal path includes an inductive transition and first and second capacitive structures. The inductive transition extends from a first point on the signal path to a second point on the signal path and has an excess impedance above the nominal impedance. The first and second capacitive structures respectively shunt the first and second points on the signal path to compensate the excess impedance of the inductive transition. The inductive transition and the first and second capacitive structures approximate a filter having an impedance substantially matching the nominal impedance over the specified bandwidth. In other aspects, a microwave circuit package that incorporates the above-described signal path and an interconnection method that includes forming the above-described signal path are described.
1. A signal path having a nominal impedance over a specified bandwidth and interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package, the signal path comprising:
an inductive transition extending from a first point on the signal path to a second point on the signal path and having an excess impedance above the nominal impedance;
wherein the first point is on the microwave circuit package and the second point is on the microwave component; and
first and second capacitive structures respectively shunting the first and second points on the signal path to compensate the excess impedance of the inductive transition, wherein the inductive transition and the first and second capacitive structures approximate a filter having an impedance substantially matching the nominal impedance over the specified bandwidth.
2. The signal path of claim 1 , wherein the first and second capacitive structures respectively shunt the first and second points on the signal path to ground.
3. The signal path of claim 1 , wherein the inductive transition comprises at least one bond wire extending from the first point to the second point.
4. The signal path of claim 3 , wherein each bond wire has a length of at least 0.4 mm.
5. The signal path of claim 3 , wherein the inductive transition comprises two bond wires with respective projections onto a common plane substantially parallel to a top surface of the microwave component, the projections being oriented with respect to each other at an angle in a range of about 50° to about 70°.
6. The signal path of claim 3 , wherein the second capacitive structure comprises a capacitive bond pad section of the signal path on the microwave component.
7. The signal path of claim 6 , wherein the first capacitive structure comprises a capacitive trace section of the signal path on the microwave circuit package.
8. A signal path having a nominal impedance over a specified bandwidth and interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package, the signal path comprising:
an inductive transition extending from a first point on the signal path to a second point on the signal path and having an excess impedance above the nominal impedance, wherein the inductive transition comprises a signal via through at least one layer of the microwave circuit package, and the first and second points are on opposite ends of the signal via; and
first and second capacitive structures respectively shunting the first and second points on the signal path to compensate the excess impedance of the inductive transition, wherein the inductive transition and the first and second capacitive structures approximate a filter having an impedance substantially matching the nominal impedance over the specified bandwidth, wherein the first capacitive structure comprises an open circuit transmission line stub connected to the first point on the signal path.
9. The signal path of claim 8 , wherein the second capacitive structure comprises an open circuit transmission line stub connected to the second point on the signal path.
10. The signal path of claim 8 , wherein the second capacitive structure comprises a capacitive trace section of the signal path connected to the second point.
11. The signal path of claim 8 , wherein the first and second capacitive structures respectively shunt the first and second points on the signal path to ground.
12. A microwave circuit package, comprising:
a port and a microwave component mounted in the microwave circuit package;
a signal path having a nominal impedance over a specified bandwidth, wherein the signal path interconnects the port and the microwave component;
an inductive transition extending from a first point on the signal path to a second point on the signal path and having an excess impedance above the nominal impedance, wherein the first point is on the microwave circuit package and the second point is on the microwave component, and the inductive transition comprises at least one bond wire extending from the first point to the second point; and
first and second capacitive structures respectively shunting the first and second points on the signal path to compensate the excess impedance of the inductive transition, wherein the inductive transition and the first and second capacitive structures approximate a filter having an impedance substantially matching the nominal impedance over the specified bandwidth.
13. The microwave circuit package of claim 12 , wherein the first and second capacitive structures respectively shunt the first and second points on the signal path to ground.