IP Library Granted Patent US 7,078,622
Granted Patent B2
US 7,078,622 · App. 10/955,440 · Granted Jul 18, 2006

IC socket assembly

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Quick Facts
Patent No.
US 7,078,622
App. No.
10/955,440
Granted
Jul 18, 2006
Kind
B2
Abstract

Deformation of a socket housing during connection of an IC package is prevented, and reliable electrical connections are secured in an IC socket assembly. The IC socket assembly is constituted by a plurality of electrical contacts; an insulative socket housing for holding the electrical contacts arranged in a matrix; a reinforcing plate having an opening at its center, through which the electrical contacts are exposed, for supporting the lower portion of the socket housing; a cover member, which is rotatably supported by the reinforcing plate, for cooperating with the reinforcing plate to sandwich and hold the IC package therebetween and to press the IC package against the electrical contacts; and reinforcing beams, which are supported by the reinforcing plate and provided across opposing edges of the opening, for supporting the socket housing.

Claims (17)

1. An IC socket assembly comprising:

a plurality of electrical contacts;

an insulative socket housing holding the electrical contacts in a matrix arrangement;

a frame-shaped reinforcing plate supporting the lower portion of the socket housing, the frame-shaped reinforcing plate having an opening at its central portion through which the plurality of electrical contacts are exposed; and

a cover member, pivotally supported by the reinforcing plate, sandwiching an IC package between the cover and the socket housing and to press the IC package against the electrical contacts; wherein:

reinforcing beams for supporting the socket housing are provided across opposing edges of the opening, supported by the reinforcing plate.

2. An IC socket assembly as defined in claim 1 , wherein:

the reinforcing beams are provided across the opening from the side of an axial support portion of the cover member to an engaging portion of the cover member.

3. An IC socket assembly as defined in claim 1 , wherein:

the reinforcing beams are housed within grooves which are formed in the bottom surface of the socket housing.

4. An IC socket assembly as defined in claim 3 , wherein:

the reinforcing beams are provided across the opening from the side of an axial support portion of the cover member to an engaging portion of the cover member.

5. An IC socket assembly as defined in claim 2 , wherein:

the plurality of electrical contacts, which are arranged in a matrix, are divided into a plurality of groups by border regions; and

the grooves are formed in the border regions.

6. An IC socket assembly as defined in claim 5 , wherein:

the reinforcing beams are provided across the opening from the side of an axial support portion of the cover member to an engaging portion of the cover member.

Assignments (2)
CHANGE OF NAME Recorded Nov 5, 2010
From: TYCO ELECTRONICS AMP K.K.
To: TYCO ELECTRONICS JAPAN G.K.
Reel/Frame 025320/0710 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2004
From: HASHIMOTO, SHINICHI; SHIRAI, HIROSHI
To: TYCO ELECTRONICS AMP K.K.
Reel/Frame 015864/0234 →