IP Library Granted Patent US 7,257,143
Granted Patent B2
US 7,257,143 · App. 10/956,798 · Granted Aug 14, 2007

Multicomponent barrier layers in quantum well active regions to enhance confinement and speed

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Quick Facts
Patent No.
US 7,257,143
App. No.
10/956,798
Granted
Aug 14, 2007
Kind
B2
Abstract

Multi-component barrier layers include formation of a GaAs layer and at least one adjacent GaAsN layer. The resulting multi-component barrier layer shape can provide enhanced (extended) offset for capture of holes and enhanced electrons. Other benefits include: a small amount of strain compensation; poorer spatial overlap of higher confined states reducing parasitics at high bias, with some small effect on the lowest confined states. Quantum wells and associated barriers layers can be grown with combinations of gallium, (Ga), arsenic, (As), nitrogen (N), aluminum (Al), antimony (Sb), phosphorous (P) and/or indium (In) placed within or about a typical GaAs substrate to achieve long wavelength VCSEL performance, e.g., with wavelengths over 1200 nm. Layers of strained quantum well material can also be supported by mechanical stabilizers.

Claims (30)

1. A vertical cavity surface emitting laser (VCSEL) comprising:

an active region having a first edge and a second edge, said active region further comprising at least one quantum well and at least one multi-component barrier, said at least one multi-component barrier layer disposed next to said at least one quantum well, wherein a portion of said at least one multi-component barrier layer comprises a reduced barrier energy to carrier flow near said at least one quantum well, thereby enhancing the speed and efficiency of the device; and

first and second confinement regions each comprising at least one confinement layer, wherein said first confinement region is disposed next to and outside of said first edge of said active region and said second confinement region is disposed next to and outside of said second edge of said active region.

2. A VCSEL as defined in claim 1 , wherein barrier energy to carrier flow is reduced immediately adjacent to said at least one quantum well on at least one of the input side or the output side of said at least one quantum well where said reduced barrier is located.

3. A VCSEL as defined in claim 2 , wherein the quantum well portion of the active region comprises at least In, Ga, As, and N, and the barrier layer components comprise Ga, As, and N.

4. A VCSEL as defined in claim 2 , wherein said at least one quantum well of said active region includes a reduced barrier layer only deployed on the carrier input side of said quantum well.

5. A VCSEL as defined in claim 2 , wherein said at least one quantum well of said active region includes a reduced barrier layer only deployed on the carrier output side of said quantum well.

6. A VCSEL as defined in claim 1 , wherein the active region includes layers formed using GaAs and at least one of In, N, P, or Sb.

7. A VCSEL as defined in claim 6 , wherein the quantum well portion of the active region comprises at least In, Ga, As, and N, and the barrier layer components comprise Ga, As, and nitrogen.

8. A VCSEL as defined in claim 1 , wherein the confining regions include layers formed using GaAs and Al.

9. A VCSEL as defined in claim 8 , further comprising extended barrier layers disposed between said active region and said confining regions where nitrogen is used in the active region.

10. A VCSEL as defined in claim 1 , further comprising at least one extended barrier layer disposed between said confinement regions and any barrier layers or quantum wells containing nitrogen and associated with said active region when said at least one confinement layers include Al.

11. A VCSEL as defined in claim 10 , wherein said barrier layers include nitrogen.

12. A VCSEL as defined in claim 10 , wherein said quantum wells include nitrogen.

13. A VCSEL as defined in claim 1 , wherein said at least one quantum well further comprises layers of a semiconductor alloy under mechanical stress interspersed with thin layers of a substrate type material used in the device and said substrate type material layers serving as mechanical stabilizers for the semiconductor alloy layers to prevent the semiconductor alloy layers from relaxing.

14. A vertical cavity surface emitting laser (VCSEL), comprising:

an active region having a first edge and a second edge, said active region further comprising at least one quantum well containing nitrogen and at least one multi-component barrier, said at least one multi-component barrier layer disposed next to said at least one quantum well, said multi-component barrier layer further comprising a layer of GaAs disposed next to a layer of GaAsN, wherein a portion of said at least one multi-component barrier layer comprises a reduced barrier energy to carrier flow near said at least one quantum well, thereby enhancing the speed and efficiency of the device; and

first and second confinement regions further comprising at least one confinement layer, wherein said first confinement region is disposed next to and outside of said first edge of said active region and said second confinement region is disposed next to and outside of said second edge of said active region.

15. A VCSEL as defined in claim 14 , wherein barrier energy to carrier flow is reduced immediately adjacent to said at least one quantum well on at least one of the input side and the output side of said at least one quantum well where said reduced barrier is located.

16. A VCSEL as defined in claim 15 , wherein the quantum well portion of the active region comprises at least In, Ga, As, and N, and the GaAsN layer of said multi-component barrier layer includes at least one of In and Sb.

17. A VCSEL as defined in claim 15 , wherein said at least one quantum well of said active region includes a reduced barrier layer only deployed on the carrier input side of said quantum well.

18. A VCSEL as defined in claim 16 wherein the quantum well portion of the active region comprises at least In, Ga, As, and N, and the barrier layer components comprise Ga, As, and nitrogen.

19. A VCSEL as defined in claim 14 , wherein the confining regions includes layers formed using GaAs and Al.

20. A VCSEL as defined in claim 19 , further comprising extended barrier layers disposed between said active region and said confining regions where nitrogen is used in the active region.

21. A VCSEL as defined in claim 14 , further comprising at least one extended barrier layer disposed between said confinement regions and any barrier layers or quantum wells containing nitrogen and associated with said active region when said at least one confinement layers include Al.

22. A vertical cavity surface emitting laser (VCSEL) comprising:

an active region having a first edge and a second edge, said active region further comprising at least one quantum well containing nitrogen and at least one multi-component barrier, said at least one multi-component barrier layer disposed next to said at least one quantum well, said multi-component barrier layer further comprising a layer of GaAs disposed next to a layer of GaAsN, wherein a portion of said at least one multi-component barrier layer comprises a reduced barrier energy to carrier flow near said at least one quantum well, thereby enhancing the speed and efficiency of the device; and

first and second confinement regions further comprising at least one confinement layer including Al; and

an extended barrier layer disposed between said first confinement regions and said active region.

23. A VCSEL as defined in claim 22 , wherein the quantum well portion of the active region comprises at least In, Ga, As, and N, and the GaAsN layer of said multi-component barrier layer includes at least one of In and Sb.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2005
From: JOHNSON, RALPH H.
To: FINISAR CORPORATION
Reel/Frame 015746/0809 →