Semiconductor light emitting device and method for manufacturing same
View Patent ↗There is provided and manufactured, at a low cost and with high yields, a semiconductor light emitting device which allows extraction of light produced in an emitter layer not only from its top surface but also from its side surfaces and which has high luminance. An AlGaInP-based semiconductor light emitting device having a contact layer 8 made of (Al y Ga 1−y ) z In 1−z P (0≦y≦1, 0<z<1) disposed between an emitter layer 3 and a transparent substrate 2 which is transparent to emission wavelengths from the emitter layer 3.
1. An AlGaInP-based semiconductor light emitting device comprising a contact layer made of (Al y Ga 1−y ) z In 1-z P (0≦y≦1, 0<z<1) disposed between an emitter layer and a transparent substrate which is transparent to emission wavelengths from the emitter layer, wherein a relative proportion of In in the contact layer is 7% to 12%, preferably 8% to 10%.
2. The semiconductor light emitting device as defined in claim 1 , wherein the transparent substrate is GaP.
3. The semiconductor light emitting device as defined in claim 1 , wherein the contact layer is Ga z In 1−z P (0.5<z<1).
4. The semiconductor light emitting device as defined in claim 1 , wherein the transparent substrate and the contact layer are joined by direct bonding.
5. The semiconductor light emitting device as defined in claim 1 , wherein a thickness of the contact layer is 8 μm or less, preferably 3 μm or less.
6. The semiconductor light emitting device as defined in claim 1 , further comprising a transparent electrode formed on the emitter layer, the transparent electrode having high light transmittance at emission wavelengths.
7. An AlGaInP-base semiconductor light emitting device comprising a contact layer made of (Al y Ga 1−y ) z In 1−z P (0≦y≦1, 0<z<1) disposed between an emitter layer and a transparent substrate which is transparent to emission wavelengths from the emitter layer, wherein a carrier concentration of the contact layer is 2×10 18 cm −3 or more, preferably 4×10 18 cm −3 or more.
8. The semiconductor light emitting device as defined in claim 7 , wherein the transparent substrate is GaP.
9. The semiconductor light emitting device as defined in claim 7 , wherein the contact layer is Ga z In 1−z P (0.5<z<1).
10. The semiconductor light emitting device as defined in claim 7 , wherein the transparent substrate and the contact layer are joined by direct bonding.
11. The semiconductor light emitting device as defined in claim 7 , wherein a thickness of the contact layer is 8 μm or less, preferably 3 μm or less.
12. The semiconductor light emitting device as defined in claim 7 , further comprising a transparent electrode formed on the emitter layer, the transparent electrode having high light transmittance at emission wavelengths.
13. An AlGaInP-base semiconductor light emitting device comprising a contact layer made of (Al y Ga 1−y ) z In 1−z P (0≦y≦1, 0<z<1) disposed between an emitter layer and a transparent substrate which is transparent to emission wavelengths from the emitter layer wherein both the contact layer and the transparent substrate are p type, and wherein a carrier concentration of the contact layer is 1×10 18 cm −3 or more, preferably 2×10 18 cm −3 or more.
14. The semiconductor light emitting device as defined in claim 13 , wherein the transparent substrate is GaP.
15. The semiconductor light emitting device as defined in claim 13 , wherein the contact layer is Ga z In 1−z P (0.5<z<1).
16. The semiconductor light emitting device as defined in claim 13 , wherein the transparent substrate and the contact layer are joined by direct bonding.
17. The semiconductor light emitting device as defined in claim 13 , wherein a thickness of the contact layer is 8 μm or less, preferably 3 μm or less.
18. The semiconductor light emitting device as defined in claim 13 , further comprising a transparent electrode formed on the emitter layer, the transparent electrode having high light transmittance at emission wavelengths.