Optical device and production method thereof
View Patent ↗An optical device includes a base and an optical element chip and translucent member attached to the base. A wiring is buried in the base. One end of the wiring is an internal terminal portion. The other end of the wiring is an external terminal portion. A semiconductor chip incorporating peripheral circuits, etc., and a metal wire for connecting a pad electrode of the semiconductor chip and the wiring are buried in the base. The semiconductor chip incorporating peripheral circuits, etc., and the metal wire are buried together with the wiring in the base by molding, whereby the optical device and the semiconductor chip incorporating peripheral circuits, etc., are integrated into a single package.
1. An optical device production method, comprising:
step (a) of forming a mold structure in which a lead frame having a wiring pattern, a semiconductor chip and a connection member for connecting the lead frame and the semiconductor chip are buried, the mold structure including a plurality of optical device formation regions, each optical device formation region surrounding an opening;
after step (a), step (b) of splitting the mold structure to form a separate part separated from the mold structure; and
after step (a), step (c) of separately attaching an optical element chip and a translucent member to the mold structure or the separate part of the mold structure such that the opening is interposed between the optical element chip and the translucent member.
2. The optical device production method according to claim 1 , wherein step (a) includes the step of attaching a lead frame, which is to be the wiring, and a sealing tape to a metal mold for resin molding while the lead frame is mounted on the sealing tape.
3. The optical device production method according to claim 1 , wherein step (a) includes the step of performing resin molding while the semiconductor chip is mounted on the lead frame.
4. An optical device, comprising:
a base provided with an opening;
a wiring comprising an internal terminal section and an external terminal section buried in the base so that an internal terminal section and the external terminal section are exposed at a lower surface of the base;
a translucent member attached to an upper surface of the base;
an optical element chip coupled to the lower surface of the base through a bump which connects an electrode pad disposed on the optical element chip to the internal terminal section of the wiring;
a semiconductor chip buried in the base; and
a connection member buried in the base, the connection member connecting the semiconductor chip and the wiring,
wherein:
the translucent member is a hologram;
the optical element chip includes a light receiving element and a light emitting element; and
the optical device is a hologram unit.
5. An optical device, comprising:
a base provided with an opening which is a hole thorough the base;
a plurality of wirings are buried in the base;
a translucent member attached to an upper surface of the case so that the translucent member covers the opening the base;
an optical element chip coupled to a lower surface of the base so that the optical element chip covers the opening of the base;
a semiconductor chip buried in the base; and
a connection member buried in the base, the connection member connecting the semiconductor chip and the wiring,
wherein:
the translucent member is a hologram;
the optical element chip includes a light receiving element and a light emitting element; and
the optical device is a hologram unit.