IP Library Granted Patent US 7,580,075
Granted Patent B2
US 7,580,075 · App. 10/958,500 · Granted Aug 25, 2009

Optical device and production method thereof

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Quick Facts
Patent No.
US 7,580,075
App. No.
10/958,500
Granted
Aug 25, 2009
Kind
B2
Abstract

A lead frame is buried in mold resin to form a mold structure. A wide blade is used to make an indentation having an alignment step in the mold structure. Then, a narrow blade is used to split the mold structure. At the outer perimeter portion of a base which is a separate part separated from the mold structure, an alignment step is formed. Due to the alignment step, an optical element, such as a mirror tube of an imaging optical system, or the like, is readily and quickly attached.

Claims (41)

1. An optical device, comprising:

an adapter having a tubular portion;

a translucent member attached to a first surface of the tubular portion of the adapter, the first surface facing against the direction of incoming light;

an optical element chip placed at a position on the adapter which faces the translucent member;

an alignment step formed in the tubular portion of the adapter, and

a mirror tube fitting into the alignment step, wherein

an outer perimeter end surface of the translucent member is located on the first surface,

a sealing member is formed on the outer perimeter end surface of the translucent member,

an outer perimeter end surface of the sealing member and a surface of the alignment step of the adaptor parallel to the outer perimeter end surface of the translucent member lie in a same plane,

the outer perimeter end surface of the sealing member and the surface of the alignment step of the adaptor are attached to an inner surface of the mirror tube.

2. The optical device of claim 1 , wherein:

the adapter includes a tubular portion, the entirety of which surrounds an opening portion; and

the optical element chip is attached onto a second surface of the tubular portion which is opposite to the first surface such that a major surface of the optical element chip faces the translucent member.

3. The optical device according to claim 2 , wherein:

a wiring is buried in the adapter by molding;

an internal terminal section, which is part of the wiring, is formed in a region in the vicinity of the opening portion near the second surface of the adapter, the internal terminal section being electrically connected to part of the optical element chip; and

an external terminal section, which is another part of the wiring, is formed in a region in the vicinity of an outer perimeter portion of the adapter near the second surface.

4. The optical device according to claim 3 , wherein the thickness of the tubular portion of the adapter is substantially uniform.

5. The optical device according to claim 1 , wherein:

the adapter includes a substrate portion and a tubular portion which encloses a space;

the optical element chip is attached to a portion of the substrate portion which corresponds to a wall of the space such that a major surface of the optical element chip faces the translucent member.

6. The optical device according to claim 5 , wherein:

at least the substrate portion of the adapter is formed by molding while at least a part of the upper surface of a wiring is exposed; and

the upper surface of the wiring and a part of the optical device are connected by a metal wire.

7. The optical device according to claim 6 , wherein the substrate portion of the adapter is integrally molded with the tubular portion.

8. The optical device according to claim 1 , wherein:

the optical element chip includes an imaging element;

the alignment step is provided such that a mirror tube fits into the alignment step; and

the optical device is a solid state imaging device.

9. The optical device according to claim 1 , wherein:

the optical element chip includes a light receiving element;

the alignment step is provided such that a mirror tube fits into the alignment step; and

the optical device is incorporated in an optical pickup device.

10. The optical device according to claim 1 , wherein:

the translucent member is a hologram;

the hologram fits into the alignment step of the tubular portion;

the optical element chip includes a light receiving element and a light emitting element; and

the optical device is a hologram unit.

11. The optical device of claim 1 , wherein the sealing member is on the first surface.

12. The optical device of claim 1 , wherein the alignment step of the adaptor is made of resin.

13. The optical device of claim 1 , wherein the translucent member and the sealing member cover the first surface completely.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2014
From: PANASONIC CORPORATION
To: COLLABO INNOVATIONS, INC.
Reel/Frame 033021/0806 →
LIEN Recorded Jan 13, 2014
From: COLLABO INNOVATIONS, INC.
To: PANASONIC CORPORATION
Reel/Frame 031997/0445 →
CHANGE OF NAME Recorded Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0653 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2004
From: MINAMIO, MASANORI; NISHIO, TETSUSHI; TSUJI, KENJI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 015880/0476 →