IP Library › Granted Patent US 7,199,599
Granted Patent B2
US 7,199,599 · App. 10/959,620 · Granted Apr 3, 2007

Integrated circuit socket with removable support

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Quick Facts
Patent No.
US 7,199,599
App. No.
10/959,620
Granted
Apr 3, 2007
Kind
B2
Abstract

An apparatus may include a body to couple to a motherboard, the body defining an opening, and a support removably coupled to the body, the support to mount in the opening and to pass electrical interconnects to electrically couple an integrated circuit to the motherboard. In further aspects, an apparatus may include a plurality of electrical interconnects disposed in respective ones of a plurality of openings of the support, the plurality of electrical interconnects to electrically couple an integrated circuit to the motherboard, a base mounted on the body, the base defining base openings to pass the plurality of electrical interconnects, wherein the base is to receive the integrated circuit and to move toward the support so as the bring electrical contacts of the integrated circuit into contact with the plurality of electrical interconnects.

Claims (44)

1. An apparatus comprising:

a body to couple to a motherboard, the body defining an opening;

a support removably coupled to the body, the support to mount in the opening;

a plurality of electrical interconnects disposed in respective ones of a plurality of openings of the support, the plurality of electrical interconnects to electrically couple an integrated circuit to the motherboard; and

an insert to maintain the plurality of electrical interconnects in the respective ones of the plurality of openings of the support, wherein the insert is to be disposed between the support and the motherboard,

wherein the support is to pass the plurality of electrical interconnects between the integrated circuit and the motherboard.

2. An apparatus according to claim 1 , further comprising:

a base mounted on the body, the base defining base openings to pass the plurality of electrical interconnects,

wherein the base is to receive the integrated circuit and to move toward the support so as to bring electrical contacts of the integrated circuit into contact with the plurality of electrical interconnects.

3. An apparatus according to claim 1 , wherein the body comprises ledges extending into the opening, and wherein the support is removably seated on the ledges.

4. An apparatus according to claim 1 , wherein the integrated circuit comprises electrical contacts in a Land Grid Array configuration.

5. An apparatus according to claim 1 , further comprising:

a cooling unit to cool the integrated circuit using liquid coolant.

6. An apparatus according to claim 5 , further comprising:

an actuator to move the cooling unit between a first position for cooling the integrated circuit and a second position for replacing the integrated circuit.

7. A method comprising:

placing an integrated circuit on a support removably coupled to a body coupled to a motherboard, the support mounted in an opening defined by the body and to pass electrical interconnects disposed in respective ones of a plurality of openings of the support to electrically couple the integrated circuit to the motherboard;

testing the integrated circuit;

removing the integrated circuit from the support;

replacing the support with a second support; and

placing a second integrated circuit on the second support.

8. A method according to claim 7 , further comprising:

after testing the integrated circuit, moving a cooling unit between a first position at which the cooling unit cools the integrated circuit during testing and a second position that enables removal of the integrated circuit from the support.

9. A method according to claim 7 , further comprising:

testing the second integrated circuit.

10. A method according to claim 7 , wherein replacing the support comprises:

determining that the support is defective.

11. A system comprising:

a motherboard;

a body coupled to the motherboard, the body defining an opening;

an integrated circuit;

a support removably coupled to the body, the support to mount in the opening;

a plurality of electrical interconnects disposed in respective ones of a plurality of openings of the support, the plurality of electrical interconnects to electrically couple the integrated circuit to the motherboard;

an insert disposed between the support and the motherboard, the insert to maintain the plurality of electrical interconnects in the respective ones of the plurality of openings of the support, and

a double data rate memory electrically coupled to the motherboard and to the integrated circuit,

wherein the support is to pass the plurality of electrical interconnects between the integrated circuit and the motherboard.

12. A system according to claim 11 , further comprising:

a base mounted on the body, the base defining base openings to pass the plurality of electrical interconnects,

wherein the base is to receive the integrated circuit and to move toward the support so as to bring electrical contacts of the integrated circuit into contact with the plurality of electrical interconnects.

13. A system according to claim 11 , wherein the body comprises ledges extending into the opening, and wherein the support is removably seated on the ledges.

14. A system according to claim 11 , further comprising:

a cooling unit to cool the integrated circuit using liquid coolant.

15. A system according to claim 14 , further comprising:

an actuator to move the cooling unit between a first position for cooling the integrated circuit and a second position for replacing the integrated circuit.