Electronic part mounting substrate, electronic part, and semiconductor device
View Patent ↗An infrared emissive first insulating portion, which radiates heat transferred from a WCSP corresponding to an electronic part to a first conductive portion as infrared radiation with high efficiency, is formed on the first conductive portion lying in a through hole provided in a printed wiring board with the WCSP mounted thereon.
1. A substrate for mounting an electronic part thereon, comprising:
a base body having a first main surface and a second main surface opposite to the first main surface, and a through hole which penetrates from the first main surface to the second main surface;
a first conductive portion formed on an inner wall surface of the through hole; and
a first insulating portion which is formed on the first conductive portion and higher in thermal emissivity than the first conductive portion.
2. A substrate according to claim 1 , wherein the first insulating portion is filled in the through hole.
3. A substrate according to claim 1 , further comprising a second insulating portion higher in thermal emissivity than the first conductive portion is formed on both or either one of the first main surface and the second main surface.
4. A substrate according to claim 1 , further comprising:
a second conductive portion formed on both or either one of the first main surface and the second main surface so as to be connected to the first conductive portion; and
a third insulating portion which is formed on the corresponding second conductive portion and higher in thermal emissivity than the first and second conductive portions.
5. A substrate according to claim 4 , wherein the second and third insulating portions are formed on the main surface opposite to the main surface on which the electronic part is mounted and wherein the first insulating portion, the second insulating portion and the third insulating portions are formed continuously.
6. A substrate according to claim 1 , wherein the first insulating portion contains ceramics.
7. A substrate according to claim 6 , wherein the ceramics contains Al 2 O 3 as a major component.
8. A semiconductor device, comprising:
a base body having a first main surface and a second main surface opposite to the first main surface, and a through hole which penetrates from the first main surface to the second main surface;
a first conductive portion formed on an inner wall surface of the through hole;
second conductive portion formed on the first main surface and the second main surface so as to be connected to the first conductive portion;
an electronic part mounted on the first main surface, said electronic part being electrically connected to the second conductive portion formed on the first main surface;
a first insulating portion which is formed on the first conductive portion and higher in thermal emissivity than the first conductive portion; and
an external terminal formed on the second conductive portion provided on the second main surface.
9. A semiconductor device according to claim 8 , further comprising a fourth insulating portion which is formed on the first main surface so as to cover a surface of the electronic part and is higher in thermal emissivity than the first and second conductive portions.
10. A semiconductor device according to claim 8 , further comprising a second insulating portion which is formed on the second main surface and is higher in thermal emissivity than the first and second conductive portions.
11. A semiconductor device according to claim 8 , further comprising a third insulating portion which is formed on the second conductive portion on the second main surface and higher in thermal emissivity than the first and second conductive portions.
12. A semiconductor device according to claim 8 , wherein the electronic part has protruded conductive portion each electrically connected to the second conductive portion.
13. A semiconductor device according to claim 12 , wherein the electronic part is a semiconductor chip having circuit elements.
14. A semiconductor device according to claim 12 , wherein the electronic part is a semiconductor package which includes a semiconductor chip having circuit elements and has the same outer size as that of the semiconductor chip.
15. A semiconductor device according to claim 8 , wherein the first insulating portion contains ceramics.
16. A semiconductor device according to claim 15 , wherein the ceramics contains Al 2 O 3 as a major component.