IP Library Granted Patent US 7,304,799
Granted Patent B2
US 7,304,799 · App. 10/960,764 · Granted Dec 4, 2007

Tunable optical filter with heater on a CTE-matched transparent substrate

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Quick Facts
Patent No.
US 7,304,799
App. No.
10/960,764
Granted
Dec 4, 2007
Kind
B2
Abstract

An optical device including: a glass substrate; a crystalline silicon layer bonded to the glass substrate; and a thermally tunable thin-film optical filter fabricated on top of the crystalline silicon layer.

Claims (20)

1. An optical device comprising:

a glass substrate;

a doped single-crystal silicon sheet-resistive heater layer bonded to the glass substrate; and

a thermally tunable thin-film optical filter fabricated on top of the doped single-crystal silicon sheet-resistive heater layer, the thermally tunable thin-film optical filter comprising at least one amorphous semiconductor layer, and having a coefficient of thermal expansion approximately matched to a coefficient of thermal expansion of the glass substrate.

2. The optical device of claim 1 , wherein the optical filter is designed to operate on an optical signal of wavelength λ and wherein the glass substrate is transparent to light of wavelength λ.

3. The optical device of claim 2 , wherein the thermally tunable optical filter is a thermo-optically tunable thin film optical filter.

4. The optical device of claim 1 further comprising electrical contacts formed on the doped single-crystal silicon sheet-resistive heater layer for supplying electrical current to the doped single-crystal silicon sheet-resistive heater layer.

5. The optical device of claim 1 , wherein the glass substrate is made of a borosilicate glass.

6. The optical device of claim 1 , wherein the amorphous semiconductor is amorphous silicon.

7. The optical device of claim 1 , wherein the thermally tunable thin film optical filter comprises a plurality of thin film interference layers.

8. The optical device of claim 7 , wherein the optical filter is designed to operate on an optical signal of wavelength λ and wherein each of the layers among the plurality of thin film layers has an optical thickness that is roughly an integer multiple of λ/4.

9. The optical device of claim 1 , wherein the thermally tunable thin film optical filter comprises a stack of multiple Fabry-Perot cavities.

10. A method of making an optical device, the method comprising:

providing a glass substrate;

bonding a doped single-crystal silicon sheet-resistive heater layer to the glass substrate; and

fabricating a thermally tunable thin-film optical filter comprising at least one amorphous semiconductor layer on top of the doped single-crystal silicon sheet-resistive heater layer, the thermally tunable thin-film optical filter having a coefficient of thermal expansion approximately matched to a coefficient of thermal expansion of the class substrate.

11. The method of claim 10 , further comprising fabricating electrical contacts on the doped single-crystal silicon sheet-resistive heater layer for supplying electrical current to the heater layer.

12. The method of claim 10 further comprising, prior to fabricating the optical filter, patterning the doped single-crystal silicon sheet-resistive heater layer to form an island on which the optical filter is fabricated.

13. The method of claim 10 , wherein the doped single-crystal silicon sheet-resistive heater layer is anodically bonded to the glass substrate.

14. The method of claim 10 , wherein the fabricating the thermally tunable thin-film optical filter on top of the doped single-crystal silicon sheet-resistive heater layer involves fabricating a thermo-optically tunable thin film, optical filter.

Assignments (7)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2022
From: II-VI PHOTONICS, (US) INC.
To: II-VI DELAWARE, INC.
Reel/Frame 060333/0742 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
CHANGE OF NAME Recorded May 6, 2014
From: PHOTOP AEGIS, INC.
To: II-VI PHOTONICS, (US) INC.
Reel/Frame 032835/0420 →
CHANGE OF NAME Recorded May 17, 2013
From: AEGIS LIGHTWAVE, INC.
To: PHOTOP AEGIS, INC.
Reel/Frame 030452/0216 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2005
From: MA, EUGENE YI-SHAN; COHEN, MITCHELL S.
To: AEGIS SEMICONDUCTOR, INC.
Reel/Frame 015576/0877 →