Structure for fixing printed circuit board and method of fixing thereof
View Patent ↗A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.
1. A structure of fixing a printed circuit board, comprising:
a mold frame coupled with a display panel;
a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel; and
an insulating film coupled to the printed circuit board and covering an outer surface of the printed circuit board so that the printed circuit board is fixed to the mold frame.
2. The structure according to claim 1 , wherein the insulating film is attached to the mold frame using an adhesive.
3. The structure according to claim 1 , wherein the insulating film is attached to the printed circuit board using an adhesive.
4. The structure according to claim 3 , wherein the adhesive includes a double-sided tape.
5. The structure according to claim 1 , wherein the insulating film completely covers the outer surface of the printed circuit board.
6. The structure according to claim 1 , wherein the insulating film includes polyethylene terephthalate (PET).
7. The structure according to claim 1 , wherein the mold frame having a hook for affixing a portion of the printed circuit board.
8. The structure according to claim 1 , wherein the mold frame having a screw hole for affixing a portion of the printed circuit board via a screw.
9. A structure of fixing a printed circuit board, comprising:
a mold frame coupled with a display panel;
a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel;
a first insulating film attached to the mold frame and the printed circuit board, the first insulating film covering an outer surface of the printed circuit board and having a protruding portion; and
a second insulating film attached to the mold frame and the first insulating film, the second insulating film covering the protruding portion,
wherein the first and second insulating films overlap with each other to fix the printed circuit board to the mold frame.
10. The structure according to claim 9 , wherein the first insulating film is attached to the printed circuit board using an adhesive.
11. The structure according to claim 10 , wherein the adhesive includes a double-sided tape.
12. The structure according to claim 9 , wherein the second insulating film is attached to the mold frame and the first insulating film using an adhesive.
13. The structure according to claim 12 , wherein the adhesive includes a double-sided tape.
14. The structure according to claim 9 , wherein the first insulating film completely covers the outer surface of the printed circuit board.
15. The structure according to claim 9 , wherein the first and second insulating films include polyethylene terephthalate (PET).
16. The structure according to claim 9 , wherein the mold frame having a hook for affixing a portion of the printed circuit board.
17. The structure according to claim 9 , wherein the mold frame having a screw hole for affixing a portion of the printed circuit board via a screw.