Integrated lead suspension and method of construction
View Patent ↗An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
1. An integrated lead suspension, comprising:
a lead wiring pad provided on a flexure section of the suspension, a bonding pad provided on a slider of a head gimbal section of the suspension, and a solder ball that is placed between the lead wiring pad and the bonding pad, so that the solder ball is melted to solder the lead wiring pad and the bonding pad together; and
the suspension comprises a bent section into which the solder ball is dropped from the surface of the lead wiring pad, using gravitational force, adjacent to the center line of the surface of the lead wiring pad; and wherein
in the bent section, an inclined surface is formed between a portion into which the solder ball is dropped and portions on both sides of said portion, wherein the entire surface of the pad is inclined.