Schottky diodes and methods of making the same
In one aspect, a Schottky diode includes a semiconductor material, and a metal material forming a Schottky barrier junction with the semiconductor material, wherein a cavity having a lateral dimension of at least 200 nm is adjacent to the Schottky barrier junction. In another aspect, a Schottky diode includes a semiconductor surface, a dielectric structure, and a contact structure. The dielectric structure defines an opening to the semiconductor surface. The contact structure extends through the opening in the dielectric structure to form a Schottky barrier junction with the semiconductor surface. The contact structure comprises a bonding pad overlying the Schottky barrier junction and at least a portion of the dielectric structure and being electrically connected to the Schottky barrier junction.
1 . A Schottky diode, comprising:
a semiconductor material; and
a metal material forming a Schottky barrier junction with the semiconductor material, wherein a cavity having a lateral dimension of at least 200 nm is adjacent to the Schottky barrier junction.
2 . The Schottky diode of claim 1 , wherein the cavity is disposed at the periphery of the Schottky barrier junction.
3 . The Schottky diode of claim 2 , wherein the cavity surrounds the Schottky barrier junction.
4 . The Schottky diode of claim 3 , wherein the cavity forms an annular ring around the Schottky barrier junction.
5 . The Schottky diode of claim 1 , further comprising a dielectric structure defining an opening to the semiconductor material, and a contact structure electrically connected to the metal material through the opening.
6 . The Schottky diode of claim 5 , wherein the dielectric structure includes a projection overhanging the semiconductor material and forming a wall of the cavity.
7 . The Schottky diode of claim 6 , wherein the dielectric structure comprises a first dielectric layer forming a side wall of the cavity and a second dielectric layer on the first dielectric layer and forming the overhanging projection.
8 . The Schottky diode of claim 7 , wherein the dielectric structure comprises a third dielectric layer on the second dielectric layer and defining a tapered portion of the opening in the dielectric structure.
9 . The Schottky diode of claim 1 , further comprising a bonding pad disposed over and electrically connected to the metal material.
10 . A method of forming a Schottky diode, comprising:
providing a semiconductor surface; and
forming a dielectric structure defining an opening to the semiconductor surface; and
forming a contact structure extending through the opening in the dielectric structure to form a Schottky barrier junction with the semiconductor surface, wherein at the semiconductor surface at least a portion of the Schottky barrier junction is spaced apart from the dielectric structure by a lateral distance of at least 200 nm.
11 . The method diode of claim 10 , wherein a cavity surrounds the Schottky barrier junction.
12 . The method of claim 11 , wherein the dielectric structure includes a projection overhanging the semiconductor surface and forming a wall of the cavity.
13 . The method of claim 12 , wherein the dielectric structure comprises a first dielectric layer forming a side wall of the cavity and a second dielectric layer on the first dielectric layer and forming the overhanging projection.
14 . The method of claim 10 , further comprising forming a bonding pad disposed over and electrically connected to the Schottky barrier junction.
15 . A Schottky diode, comprising:
a semiconductor surface;
a dielectric structure defining an opening to the semiconductor surface; and
a contact structure extending through the opening in the dielectric structure to form a Schottky barrier junction with the semiconductor surface, wherein the contact structure comprises a bonding pad overlying the Schottky barrier junction and at least a portion of the dielectric structure and being electrically connected to the Schottky barrier junction.
16 . The Schottky diode of claim 15 , wherein the contact structure comprises a Schottky metal layer electrically connected to the bonding pad and forming the Schottky barrier junction with the semiconductor surface.
17 . The Schottky diode of claim 15 , wherein a top portion of the opening in the dielectric structure is tapered.
18 . The Schottky diode of claim 15 , wherein a bottom portion of the dielectric structure defines at least part of a cavity at the semiconductor surface adjacent to the Schottky barrier junction.
19 . A method of forming a Schottky diode, comprising:
providing a semiconductor surface;
forming a dielectric structure defining an opening to the semiconductor surface; and
forming a contact structure extending through the opening in the dielectric structure to form a Schottky barrier junction with the semiconductor surface, wherein the contact structure comprises a bonding pad overlying the Schottky barrier junction and at least a portion of the dielectric structure and being electrically connected to the Schottky barrier junction.
20 . The method of claim 19 , wherein a bottom portion of the dielectric structure defines at least part of a cavity at the semiconductor surface adjacent to the Schottky barrier junction.