IP Library Patent Application 10964603
Patent Application
App. No. 10/964,603

Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making same

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Patent No.
US None
App. No.
10/964,603
Abstract

A polishing pad for use in chemical mechanical polishing of substrates that being made of fibrous matrix such as cellulose with a binder consisting of thermoset resin material, such as phenolic resin. The polishing surface is ground to form asperities. The polishing pad provides a porous structure by which polishing slurry and polishing debris during chemical mechanical polishing of substrates are stored for subsequent rinsing away, and for enhanced flow-distribution of the polishing slurry. Also disclosed is a method of making the polishing pad.

Claims (31)

1 - 17 . (canceled)

18 . A method of making a fiber matrix as a medium for subsequent resin impregnation, for use in pads for chemical-mechanical polishing of substrates, comprising:

making said fiber matrix made by a paper-making wet-laid process comprising the following steps:

(a) dispersing paper-making cellulosic fibers in water to form a paper-making slurry;

(b) delivering the paper-making slurry of said step (a) to a paper-making machine and making a paper sheet in said paper-making machine;

(c) said step (b) comprising draining water from the slurry to form a continuous paper sheet;

(d) drying the wet-laid continuous paper sheet of said step (c) for creating a relatively soft, compliant fiber matrix from which polishing pads for use in chemical mechanical polishing of substrates are formed;

(e) cutting said dried sheet of said step (d) into a series of CMP polishing pads.

19 . The method according to claim 18 , wherein said steps (b) through (d) are performed by at least one of the following: a handsheet mold, a fourdrinier machine, an incline wire machinery, roto-former machine, twin wire machine.

20 . The method according to claim 18 , wherein said steps (b) through (d) are performed by using a suction process.

21 . The method according to claim 18 , wherein said step (a) also comprises dispersing a latex binder, or equivalent thereof, in the water to form a slurry of fibers and binder.

22 . The method according to claim 19 , further comprising, before said step (d), applying a latex binder, or equivalent thereof, to the fiber surfaces.

23 . A method of forming polishing pads for use in chemical mechanical polishing of substrates, comprising:

(a) forming a fiber matrix sheet made of paper-making fibers on a paper-making machine;

(b) impregnating the fiber matrix sheet with a binder material;

(c) curing the binder material with heat to form a fiber matrix sheet that is relatively soft and compliant;

(d) said step (b) comprising binding the fiber matrix with a thermoset resin.

24 . The method according to claim 23 , wherein said step (d) comprises using a binder from at least one of the following: phenolic, epoxy, silicone, and modified phenolics, wherein said step) (b) is done by soaking the fiber matrix sheet in a bath of liquid resin.

25 . The method according to claim 23 , wherein said step (d) comprises exposing the fiber matrix to curtains of liquid resin, or spraying liquid resin onto the fiber matrix.

26 . The method according to claim 23 , further comprising densifying the resin impregnated matrix.

27 . The method according to claim 23 , further comprising forming a grooved-surface pattern in the surface of the fiber matrix sheet.

28 . The method according to claim 27 , wherein said step of forming a grooved-surface pattern is performed after the thermoset resin is fully cured.

29 . The method according to claim 28 , wherein said step of forming a grooved-surface pattern comprises embossing the grooved-surface pattern.

30 - 40 . (canceled)

41 . The method according to claim 18 , wherein said step (a) further comprises adding thermoset resin material in addition to said paper-making cellulosic fibers and water to form said a paper-making slurry;

said method further comprising:

(e) curing said continuous paper sheet after said step (d).

42 . The method according to claim 18 , wherein said step (a) further comprises adding thermoset resin material in addition to said paper-making cellulosic fibers and water to form said a paper-making slurry; said step (e) comprising cutting said continuous paper sheet after said step (d) into pad-sized blanks, and then curing said pad-sized blanks.

43 . The method according to claim 18 , wherein said method further comprises:

(f) impregnating said continuous paper sheet with thermoset resin; and

(g) curing said continuous paper sheet after said step (f).

Assignments (2)
MERGER Recorded Oct 22, 2009
From: RAYTECH SYSTEMS, LLC
To: RAYBESTOS POWERTRAIN, LLC
Reel/Frame 023409/0243 →
PATENT, TRADEMARK AND LICENSE MORTGAGE Recorded Jun 28, 2006
From: RAYTECH CORPORATION; RAYBESTOS, LLC; RIH, LLC; RAYTECH POWERTRAIN, INC.; ALLOMATIC PRODUCTS COMPANY; RAYTECH SYSTEMS, INC.; RAYBESTOS POWERTRAIN, LLC; RAYTECH INNOVATIVE SOLUTIONS, LLC; RAYTECH COMPOSITES, INC.; RAYBESTOS PRODUCTS COMPANY; RAYBESTOS AUTOMOTIVE COMPONENTS COMPANY; RIHL, LLC
To: THE CIT GROUP/BUSINESS CREDIT, INC.
Reel/Frame 017846/0533 →