IP Library Granted Patent US 7,030,442
Granted Patent B2
US 7,030,442 · App. 10/965,160 · Granted Apr 18, 2006

Stack-film trench capacitor and method for manufacturing the same

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Quick Facts
Patent No.
US 7,030,442
App. No.
10/965,160
Granted
Apr 18, 2006
Kind
B2
Abstract

A trench capacitor includes an electrode having a first conductive area formed in a trench provided in a substrate, and a second conductive area extending from a bottom of the trench, the second conductive area being electrically coupled to the first conductive area and spaced apart from the first conductive area; a storage node having a first conductive extension extending into a first dielectric space provided between the first conductive area and the second conductive area of the electrode, and a second conductive extension extending into a second dielectric space provided within the second conductive area of the electrode; and a dielectric layer electrically insulating the electrode from the storage node.

Claims (27)

1. A trench capacitor, comprising:

an electrode including

a first conductive area formed in a trench provided in a substrate, and

a second conductive area extending from a bottom of the trench, the second conductive area being electrically coupled to the first conductive area and spaced horizontally apart from the first conductive area;

a storage node including

a first conductive extension extending into a first dielectric space provided between the first conductive area and the second conductive area of the electrode, and

a second conductive extension extending into a second dielectric space provided within the second conductive area of the electrode; and

a dielectric layer electrically insulating the electrode from the storage node.

2. The trench capacitor of claim 1 , wherein the first conductive area comprises a portion of a doped substrate and surrounds a sidewall of the trench.

3. The trench capacitor of claim 1 , wherein the trench capacitor further comprises a collar provided at an upper sidewall of the storage node to electrically insulate the storage node from the substrate.

4. A trench capacitor formed in a trench formed within a semiconductor substrate, comprising:

an electrode having a double-crown structure including

an outer conductive crown comprising a doped semiconductor substrate, and

an inner conductive crown spaced apart from the outer conductive crown and electrically coupled to the outer conductive crown;

a storage node extending into a first dielectric space formed between the outer conductive crown and the inner conductive crown and extending into a second dielectric space formed within the inner conductive crown; and

a dielectric layer electrically insulating the electrode from the storage node.

5. The trench capacitor of claim 4 , wherein the inner conductive crown comprises a loop in the shape of a vertical wall extending from a bottom of the trench, and the inner conductive crown is spaced horizontally apart from the outer conductive crown.

6. The trench capacitor of claim 4 , wherein the outer conductive crown comprises a portion of a doped substrate surrounding a sidewall of the trench.

7. The trench capacitor of claim 4 , wherein the trench capacitor further comprises a collar surrounding an upper sidewall of the storage node to electrically insulate the storage node from the substrate.

8. A trench capacitor formed in a trench within a semiconductor substrate, comprising:

an electrode having a plurality of electrode prongs, each of the electrode prongs being electrically coupled to the other electrode prongs, wherein at least one electrode prong is comprised of a portion of a doped substrate;

a storage node having a plurality of storage node prongs, each of the storage node prongs being electrically coupled to the other storage node prongs, at least one of the storage node prongs extending into a dielectric space provided between two of the electrode prongs; and

a dielectric layer electrically insulating the electrode from the storage node.

9. The trench capacitor of claim 8 , wherein the at least one electrode that is comprised of the portion of the doped substrate additionally comprises a lower portion of the substrate and surrounds a sidewall of the trench.

10. The trench capacitor of claim 8 , wherein the trench capacitor further comprises a collar surrounding an upper sidewall of the storage node to electrically insulate the storage node from the substrate.

11. The trench capacitor of claim 8 , wherein the electrode is U-shaped.

12. The trench capacitor of claim 8 , wherein the storage node is U-shaped.