Laser trim motion, calibration, imaging, and fixturing techniques
A system for probing circuit elements, includes a panel fixture, probe holder and stage. The fixture has a platen surface to support a work piece having work piece surface. The work piece surface is substantially parallel to the platen surface and has a target element thereon. The probe holder is configured to support a probe for detecting a characteristic of the target element. A stage rotates the probe holder about an axis substantially orthogonal to the platen surface, to align the probe with probe locations associated with the circuit element, so that the characteristic of the circuit element can detected by the probe. Fixturing motion can be optimized for efficient work piece manufacturing. Calibration and vision subassemblies are also provided.
1 . A system for probing circuit elements, comprising:
a fixture having a platen surface configured to support a work piece having a target element;
a probe holder configured to support a probe for detecting a characteristic of the target element;
a first stage configured to rotate the probe holder about an axis substantially orthogonal to the platen surface, thereby enabling differently orientated circuits on the work piece to be probed;
a second stage operatively coupled to the first stage and configured to move the probe holder substantially parallel to the axis; and
a controller configured to control the first stage, so as to automatically align probe tips of the probe with corresponding probe locations associated with the target element.
2 . The system of claim 1 further comprising:
an emitter configured to emit a beam of light to lase the target element, wherein the probe is further configured to detect the characteristic of the target element at least one of before, during, and after lasing.
3 . The system of claim 1 wherein the second stage is further configured to move the probe holder between a first stop location where the probe tips do not contact their corresponding probe locations and a second stop location where the probe tips contact their corresponding probe locations.
4 . The system of claim 3 wherein the second stage is further configured to move the probe holder to a third stop location located between the first and the second stop locations and at which the supported probe will not contact the probe locations.
5 . The system of claim 1 wherein the second stage is further configured to move the probe holder to a first stop location for loading of the work piece onto the fixture, and to a second stop location with the work piece loaded on the fixture.
6 . The system of claim 1 further comprising:
a third stage configured to move the fixture substantially parallel to the platen surface;
wherein the second stage is further configured to move the probe holder to a first stop location during loading of the work piece onto the fixture, to a third stop location during third stage movement of the fixture with the work piece loaded on the fixture, and to a second stop location during probing of the target element.
7 . The system of claim 1 further comprising:
a second stage configured to move the probe holder substantially parallel to the axis; and
a third stage configured to move the fixture substantially parallel to the platen surface.
8 . The system of claim 7 wherein the third stage is configured to move the fixture in a first direction, the system further comprising:
a fourth stage configured to move the fixture in a second direction substantially parallel to the platen surface and perpendicular to the first direction.
9 . The system of claim 7 wherein the second stage is mounted to the first stage, and either the third stage is further configured to move the fourth stage with the fixture in the first direction or the fourth stage is further configured to move the third stage with the fixture in the second direction.
10 . The system of claim 7 wherein the third and fourth stages are further configured to move at a different accelerations.
11 . The system of claim 7 wherein the third stage is further configured to move over a first travel distance, and the fourth stage is further configured to move over a second travel distance.
12 . The system of claim 11 wherein the first stage is further configured to move at a first acceleration, and the second stage is further configured to move at a second acceleration.
13 . The system of claim 12 wherein the first travel distance is greater than the second travel distance, and the first acceleration is greater than the second acceleration.
14 . The system of claim 12 wherein the first stage is configured to rotate the probe holder through an angle in the range of at least 40 degrees to 280 degrees.
15 . A system for probing circuit elements, comprising:
a fixture having a surface configured to support a work piece having a target element;
a probe holder configured to support a probe for detecting a characteristic of the target element;
a first stage configured to rotate the probe holder about an axis substantially orthogonal to the surface;
a controller configured to control the first stage, so as to automatically align probe tips of the probe with corresponding probe locations associated with the target element;
an emitter configured to emit a beam of light to lase the target element; and
a camera positioned to view the target element through the scan lens, wherein the camera has a viewing path that is substantially coaxial with a path of the beam.
16 . The system of claim 15 further comprising:
a focus telescope configured to simultaneously maintain optical focus of both the beam and the camera at the target element.
17 . A system for probing circuit elements, comprising:
a fixture having a platen surface configured to support a work piece having a target element, the fixture including a calibration subassembly configured to aid automatic calibration during at least one of probe card planarization, probe card alignment, galvo calibration, laser power measurement, and probe tip cleaning;
a probe holder configured to support a probe for detecting a characteristic of the target element; and
a first stage configured to rotate the probe holder about an axis substantially orthogonal to the platen surface, so as to automatically align probe tips of the probe with corresponding probe locations associated with the target element.
18 . The system of claim 17 wherein the calibration subassembly includes a planarization plate for use during automatic planarization of the probe relative to the work piece.
19 . The system of claim 17 wherein the calibration subassembly includes a probe alignment plate having conductive test features for use during automatic probe alignment, where X-Y offset and theta rotation offset between the work piece and the probe are determined.
20 . The system of claim 17 wherein the calibration subassembly includes a calibration aperture and a detector used for at least one of automatically determining position of the beam within a scan field and correlating beam path to a vision path.
21 . The system of claim 17 wherein the calibration subassembly includes a power meter head for use in automatically measuring power of the beam at the work piece.
22 . The system of claim 17 wherein the calibration subassembly includes a probe tip scrub pad for use in automatically cleaning the probe tips of the probe.
23 . The system of claim 17 wherein the calibration subassembly is accessible even when work piece is mounted on the fixture, thereby allowing real-time automatic calibration procedures to be carried out.
24 . The system of claim 17 wherein the calibration subassembly is in substantially the same plane as the platen surface.
25 . A system for positioning a work piece for lasing, comprising:
a fixture having a surface substantially parallel to a plane and defined by a first axis and a second axis that is orthogonal to the first axis, the surface for supporting a work piece configured with a plurality of different areas disposed thereon, with each area including one or more circuit elements to be lased;
a first stage configured to move the fixture substantially parallel to the plane and the first axis;
a second stage configured to move the first stage and the fixture substantially parallel to the plane and the second axis; and
a controller configured to determine a path for movement between the different areas by directing movement of the first stage and the second stage based on distances along the first axis between each of the different areas and distances along the second axis between each of the different areas, thereby positioning each of the plurality of different areas for lasing the one or more circuit elements included in that area.
26 . The system of claim 25 wherein the controller is further configured to compute total time periods of movement of the first and the second stages to move the work piece respectively along the path based on the distances along the first axis and the distances along the second axis, to compare the computed total time periods, and to direct the movement of the first and the second stages in accordance with a result of the comparison.
27 . The system of claim 25 wherein the controller is further configured to determine a path for movement that is associated with a travel time that is comparable or shorter than travel time of other possible paths.
28 . The system of claim 27 further comprising:
a probe for measuring a characteristic of the one or more circuit elements included in the each area after positioning that area in a lasing position;
wherein the controller is further configured to compute rotation of the probe in correspondence with the movement of the work piece along the path, based on the respective angular orientation of each of the plurality of different areas.