Polyetherimide composition, film, process, and article
Various embodiments of a polymer composition are provided. In one embodiment the polymer composition includes, by weight, from about 50% to about 95% polyetherimide resin and from about 5% to about 50% inorganic substance. The polymer composition when formed into a film has a coefficient of thermal expansion of less than about 50 ppm/° C.
1 . A polymer composition, comprising by weight:
from 50% to 95% of a polyetherimide resin;
from 5% to 50% inorganic substance; and
wherein the polymer composition when converted into a film, has a CTE of less than 50 ppm/° C.
2 . The polymer composition of claim 1 , wherein the film has a thickness of 750 microns or less.
3 . The polymer composition of claim 1 , wherein the polymer composition comprises from 10% to 40% polyetherimide resin and the film has a CTE that ranges from 48 to 24 ppm/° C.
4 . The polymer composition of claim 1 , wherein the film has an average surface roughness of 2.0 microns or less according to ANSI B46.1.
5 . The resin composition of claim 1 , wherein the inorganic substance is selected from the group consisting of: aluminum oxide, zinc oxide, mica, silica, glass, carbon, nanocomposites, silicon dioxide, titanium dioxide, calcium sulfate, barium sulfate, calcium carbonate, fluropolymer, zeolite, silicates, and mixtures thereof.
6 . The resin composition of claim 1 , wherein the polymer composition comprises from 10% to 40% inorganic substance and the film has a CTE that ranges from 48 to 24 ppm/° C.
7 . The resin composition of claim 6 , wherein the inorganic substance is selected from the group consisting of: aluminum oxide, zinc oxide, mica, silica, glass, nanocomposites and mixtures thereof.
8 . The resin composition of claim 7 , wherin the organic substance comprises mica.
9 . The resin composition of claim 6 , wherein the film has an average surface roughness of less than 1.0 microns according to ANSI B46.1.
10 . The resin composition of claim 1 , wherein the particle size of the inorganic substance has an average particle size that ranges from 0.01 microns to 2.0 microns.
11 . The polymer composition of claim 1 , wherein the polyetherimide resin comprises repeating units having the following formula
where T and R 1 are independently selected from substituted and unsubstituted divalent aromatic radicals.
12 . The polymer composition of claim 1 , wherein the composition is converted into a film via extrusion.
13 . The polymer composition of claim 1 , wherein the composition is formed into a film via solution casting.
14 . The polymer composition of claim 6 , wherein the film has a thickness that ranges from 10 microns to 150 microns and has an average surface roughness of 1.0 micron or less.
15 . The polymer composition of claim 13 , wherein the inorganic substance comprises silica.
16 . The polymer composition of claim 15 , wherein the film has an average surface roughness of 0.7 micron or less according to ANSI B46.1.
17 . The polymer composition of claim 16 , wherein the polymer composition comprises fumed silica treated with silicone.
18 . The polymer composition of claim 17 , wherein the composition comprises from 20% to 40% fumed silica and the film has a CTE that ranges from 46-34 ppm/° C.
19 . The polymer composition of claim 18 , wherein:
the average particle size of the fumed silica ranges from 0.01 to 2.0 microns,
20 . The polymer composition of claim 16 , wherein the silica is treated with a compound selected from the group consisting of: amino silane, phenyl silane, alkyl silane, methacryloxypropyl silane, glycidoxypropyl silane, aminoproply trimethoxysilane and mixtures thereof.
21 . The polymer composition of claim 16 , wherein;
the composition comprises fused silica treated with silane; and
the film has an average surface roughness of less than 0.45 microns according to ANSI B46.1.
22 . The polymer composition of claim 21 , wherein the fused silica has an average particle size that ranges from 0.1 micron to 2.0 microns.
23 . The polymer composition of claim 22 , wherein the film is made by solution casting.
24 . A polymer composition consisting essentially of:
from 50% to 95% of a polyetherimide resin;
from 5% to 50% inorganic substance; and
wherein the polymer composition when formed into a film, has a CTE of less than 50 ppm/C.
25 . A film comprising:
from 50% to 95% by weight polyetherimide resin;
from 5% to 50% inorganic substance.
26 . The film of claim 25 , wherein the film has a CTE of less than 50 ppm/° C.
27 . The film of claim 25 , wherein the film has an average surface roughness of less than about 2.0 microns according to ANSI B46.1.
28 . The film of claim 27 , wherein the film has a thickness that ranges from 10 microns to 750 microns.
29 . The film of claim 25 , wherein:
the film comprises from 10% to 40% inorganic substance; and
the film has a CTE that ranges from 48 to 24 ppm/° C.
30 . The film of claim 29 , wherein the inorganic substance is selected from the group consisting of: aluminum oxide, zinc oxide, mica, silica, glass, carbon, nanocomposites, silicon dioxide, titanium dioxide, calcium sulfate, barium sulfate, calcium carbonate, fluropolymer, zeolite, silicates, and mixtures thereof.
31 . The film of claim 29 , wherein the inorganic substance comprises mica.
32 . The film of claim 30 , wherein the film has a CTE that ranges from 48 to 34 ppm/° C.
33 . The film of claim 32 , wherein the inorganic substance is selected from the group consisting of: aluminum oxide, zinc oxide, mica, silica, glass, nanocomposites, and mixtures thereof.
34 . The film of claim 32 wherein the film has a thickness that ranges from about 10 microns to 150 microns and has an average surface roughness of 1.0 micron or less according to ANSI B46.1.
35 . The resin composition of claim 25 , wherein the inorganic substance has an average particle size that ranges from 0.01 micron to 2.0 microns.
36 . The film of claim 25 , wherein the polyetherimide comprises repeating units having the following formula (I)
wherein T is —O— or a group of the Formula —O-Z-O—, wherein the divalent bonds of the —O— or the —O-Z-O— group are in the 3,3′, 3,4′, 4,3′, or the 4,4′ positions, and wherein Z comprises the divalent radicals of Formula (II):
and wherein Q is a divalent moiety selected from the group consisting of —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — and halogenated derivatives thereof, or a group of the formula —O-Z-O— wherein the divalent bonds of the —O— or the —O-Z-O— group are in the 3,3′, 3,4′, 4,3′, or the 4,4′ positions, and wherein Z comprises the divalent radicals of Formula (II).
37 . The film of claim 25 wherein:
the inorganic substance comprises silica; and
the film has a CTE that ranges from from 48 to 34 ppm/° C.
38 . The polymer composition of claim 37 , wherein the film has an average surface roughness of 0.7 micron or less according to ANSI B46.1.
39 . The film of claim 37 , wherein the inorganic substance comprises fumed silica treated with silicone.
40 . The film of claim 39 , wherein:
the film comprises from 20% to 40% fumed silica;
and the film has a CTE that ranges from 46-34 ppm/° C.
41 . The film of claim 40 , wherein:
the average particle size of the fumed silica ranges from 0.01 to 2.0 microns; and
the fumed silica is treated with dimethyl silicone fluid.
42 . The film of claim 38 , wherein the inorganic substance comprises fused silica treated with silane.
43 . The film of claim 42 , wherein the film has an average surface roughness of 0.45 micron or less according to ANSI B46.1.
44 . The film of claim 43 , wherein:
the fused silica has an average particle size that ranges from 0.1 to 2.0 microns; and
the fused silica is treated with a compound selected from the group consisting of amino silane and phenyl silane.
45 . The film of claim 25 , wherein the film is made by solution casting.
46 . A process for making a polymer film, the process comprising the steps of:
preparing a casting solution comprising solids and solvent, wherein the solids comprise, by weight:
from 50-95% polyetherimide and
from 5% to 50% inorganic substance;
casting a layer of the casting solution onto a substrate; and
removing solvent from the layer of casting solution.
47 . The process of claim 46 , wherein the casting solution comprises, by weight, from 5% to 30% solids and 70% to 95% solvent.
48 . The process of claim 46 , further comprising;
mixing particles of the polyetherimide and the inorganic substance with solvent to prepare the casting solution.
49 . The process of claim 46 , further comprising:
melt compounding the polyetherimide and the inorganic substance to produce the polymer composition; and
mixing the polymer compound with solvent to produce the casting solution.
50 . The process of claim 49 , wherein the solvent is selected from the group consisting of: acetophenone, anisole, chlorobenzene, dichlorobenzenes, xylene, toluene, mesitylene, dimethyl acrylamide, methylene chloride, polar aprotic solvents, and mixtures thereof.
51 . The process of claim 46 , wherein the inorganic substance is selected from the group consisting of: aluminum oxide, zinc oxide, mica, silica, glass, carbon, nanocomposites, silicon dioxide, titanium dioxide, calcium sulfate, barium sulfate, calcium carbonate, fluropolymer, zeolite, silicates, and mixtures thereof.
52 . The process of claim 46 , wherin the inorganic substance is selected from the group consisting of: aluminum oxide, zinc oxide, mica, silica, glass, nanocomposites, and mixtures thereof.
53 . The process of claim 52 , wherein the film comprises from 10% to 40% inorganic substance and the film has a CTE that ranges from 48 to 24 ppm/° C.
54 . The process of clam 53, wherein the film has a CTE that ranges from about 48 to 34 ppm/° C. and the average surface roughness of the film is 2.0 microns or less according to ANSI B46.1.
55 . The process of claim 54 , wherein the thickness of the film ranges from 10 microns to 150 microns and the inorganic substance has an average particle size that ranges from 0.01 microns to 2.0 microns
56 . A process for making a polymer film, the process comprising the steps of:
extruding a film comprising a polymer composition, the polymer composition comprising, by weight, from 50% to 95% polyetherimide and from 5% to 50% inorganic substance.
57 . The process of claim 56 , wherein the polymer composition comprises from 10% to 40% inorganic substance and the film has a CTE that ranges from 48 to 24 ppm/° C.
58 . The process of claim 57 , wherein the film has a CTE that ranges from 48 to 34 ppm/° C. and the average surface roughness of the film is 1.0 micron or less according to ANSI B46.1.
59 . An article comprising:
a substrate; and
a film disposed on the substrate, the film comprising from 50% to 95% of polyetherimide and from 5% to 50% inorganic substance.
60 . The article of claim 59 , wherein the film has a CTE that ranges from 48 to 24 ppm/° C.
61 . The article of claim 60 , wherein the film has a CTE that ranges from 48 to 34 ppm/° C. and the average surface roughness of the film is 2.0 microns or less according to ANSI B46.1.