Method of fabricating thin film transistor array substrate
View Patent ↗A method of fabricating a thin film transistor array substrate is provided. The method includes forming a first conductive pattern group on a substrate using a first etch resist and a first soft mold, the first conductive pattern group including a gate electrode and a gate line; forming a gate insulating film on the substrate and the first conductive pattern group; forming a second conductive pattern group and a semiconductor pattern on the gate insulating film using a second etch resist and a second soft mold, the second conductive pattern group having a source electrode, a drain electrode, and a data line, the semiconductor pattern defining a channel region between the source electrode and the drain electrode; forming a passivation film on the gate insulating film, the second conductive pattern group and the semiconductor pattern using a third etch resist and a third soft mold, the passivation film defining a contact hole therethrough; and forming a third conductive pattern group on the passivation film using a fourth etch resist and a fourth soft mold, the third conductive pattern group having a pixel electrode.
1. A method of fabricating a thin film transistor array substrate, comprising:
forming a first conductive pattern group on a substrate using a first etch resist and a first soft mold, the first conductive pattern group including a gate electrode and a gate line;
forming a gate insulating film on the substrate and the first conductive pattern group;
forming a second conductive pattern group and a semiconductor pattern on the gate insulating film using a second etch resist and a second soft mold, the second conductive pattern group including a source electrode, a drain electrode, and a data line, the semiconductor pattern defining a channel region between the source electrode and the drain electrode;
forming a passivation film on the gate insulating film, the second conductive pattern group and the semiconductor pattern using a third etch resist and a third soft mold, the passivation film defining a contact hole therethrough; and
forming a third conductive pattern group on the passivation film using a fourth etch resist and a fourth soft mold, the third conductive pattern group including a pixel electrode.
2. The method according to claim 1 , wherein the step of forming the first conductive pattern group includes:
forming a gate metal layer and the first etch resist on the substrate;
pressurizing the first soft mold on the first etch resist and, simultaneously, heating the substrate to form a first etch resist pattern, wherein the first soft mold defines a groove corresponding to the first conductive pattern group;
separating the first soft mold from the first etch resist pattern; and
etching the gate metal layer using the first etch resist pattern as a mask.
3. The method according to claim 2 , wherein the step of forming the first etch resist pattern includes applying a load weight of the first soft mold onto the first etch resist for about 10 minutes to 2 hours at a temperature about or less than 130° C. (degrees Celsius).
4. The method according to claim 2 , further comprising removing the first etch resist pattern using a striper liquid of an alcohol system after the etching step.
5. The method according to claim 1 , wherein the step of forming the second conductive pattern group and the semiconductor pattern includes:
sequentially forming a first semiconductor layer, a second semiconductor layer, a data metal layer, and the second etch resist;
pressurizing the second soft mold on the second etch resist and, simultaneously, heating the substrate to form a second etch resist pattern having a stepped portion, wherein the second soft mold has a first groove corresponding to the second conductive pattern group and the semiconductor pattern, and wherein the second soft mold has a second groove corresponding to the channel region, the second groove having a height different from that of the first groove;
separating the second soft mold from the second etch resist pattern;
wet-etching the data metal layer using the second etch resist pattern as a mask;
dry-etching the first and the second semiconductor layers using the second etch resist pattern as a mask;
ashing the second etch resist pattern; and
etching the data metal layer and the second semiconductor corresponding to the channel region using the ashed second etch resist pattern as a mask.
6. The method according to claim 5 , wherein the step of forming the second etch resist pattern includes applying a load weight of the second soft mold onto the second etch resist for about 10 minutes to 2 hours at a temperature about or less than 130° C. (degrees Celsius).
7. The method according to claim 5 , further comprising removing the second etch resist pattern using a striper liquid of an alcohol system after the etching step.
8. The method according to claim 1 , wherein the step of forming the passivation film defining the contact hole includes:
forming a passivation film and the third etch resist on the gate insulating film having the second conductive pattern group including the semiconductor pattern thereon;
pressurizing the third soft mold on the third etch resist and, simultaneously, heating the substrate to form a third etch resist pattern, wherein the third soft mold has a protrusion corresponding to the contact hole;
separating the third soft mold from the third etch resist pattern; and
etching the passivation film using the third etch resist pattern as a mask.
9. The method according to claim 8 , wherein the step of forming the third etch resist pattern includes applying a load weight of the third soft mold onto the third etch resist for about 10 minutes to 2 hours at a temperature about or less than 130° C. (degrees Celsius).
10. The method according to claim 8 , further comprising removing the third etch resist pattern using a striper liquid of an alcohol system after the etching step.
11. The method according to claim 1 , wherein the step of forming the third conductive pattern group having the pixel electrode includes:
forming a transparent conductive film and the fourth etch resist on the passivation film;
pressurizing the fourth soft mold on the fourth etch resist and, simultaneously, heating the substrate to form a fourth etch resist pattern, wherein the fourth soft mold has a groove corresponding to the third conductive pattern group;
separating the fourth soft mold from the fourth etch resist pattern; and
etching the transparent conductive film using the fourth etch resist pattern as a mask.
12. The method according to claim 11 , wherein the step of forming the fourth etch resist pattern includes applying a load weight of the fourth soft mold onto the fourth etch resist for about 10 minutes to 2 hours at a temperature about or less than 130° C. (degrees Celsius).
13. The method according to claim 11 , further comprising removing the fourth etch resist pattern using a striper liquid of an alcohol system after the etching step.
14. The method according to claim 1 , wherein at least one of the first to the fourth etch resists includes an ethanol solution having a novolac resin of about 5 weight % to 30 weight % added thereto.
15. The method according to claim 1 , wherein at least one of the first to the fourth soft molds includes one of a polydimethylsiloxane (PDMS), a polyurethane, and a cross-linked novolac resin.
16. A method of fabricating a thin film transistor array substrate, comprising:
forming at least one thin film of a conductive layer, a semiconductor layer, and an insulating layer on a substrate;
forming an etch resist on the at least one thin film;
pressure contacting a soft mold onto the etch resist and, simultaneously, heating the substrate to form an etch resist pattern;
separating the soft mold from the etch resist pattern; and
etching the thin film using the etch resist pattern as a mask to form at least one of a conductive pattern, a semiconductor pattern, and an insulating pattern.
17. The method according to claim 16 , wherein the soft mold includes a groove corresponding to the etch resist pattern or a protrusion contacting with the etch resist to define a space.
18. The method according to claim 17 , wherein the step of pressure contacting the soft mold onto the etch resist and, simultaneously, heating the substrate to form the etch resist pattern includes applying a load weight of the soft mold onto the etch resist for about 10 minutes to 2 hours at a temperature about or less than 130° C. (degrees Celsius) while the etch resist moves into the space defined by the soft mold.
19. The method according to claim 16 , the etch resist includes an ethanol solution having a novolac resin of about 5 weight % to 30 weight % added thereto.
20. The method according to claim 16 , wherein the soft mold includes one of a polydimethylsiloxane (PDMS), a polyurethane, and a cross-linked novolac resin.
21. The method according to claim 16 , further comprising removing the etch resist pattern using a striper liquid of an alcohol system after the etching step.
22. The method according to claim 16 , wherein the step of pressure contacting the soft mold onto the etch resist includes applying a load weight of the soft mold onto the etch resist.
23. The method according to claim 16 , further comprising removing the etch resist pattern after the etching step.
24. The method according to claim 16 , wherein, during the step of pressure contacting the soft mold onto the etch resist, the etch resist moves into a space defined in a surface of the soft mold.