Method for making a strain-relieved tunable dielectric thin film
Tunable dielectric thin films are provided which possess low dielectric losses at microwave frequencies relative to conventional dielectric thin films. The thin films include a low dielectric loss substrate, a buffer layer, and a crystalline dielectric film. Barium strontium titanate may be used as the buffer layer and the crystalline dielectric film. The buffer layer provides strain relief during annealing operations.
1 . a method of making a tunable dielectric thin film, comprising:
depositing a buffer layer on substrate; and
depositing a layer of crystalline dielectric film on said buffer layer, wherein the annealed crystalline dielectric film is capable of dielectric tuning of at least about 10 percent at 50V/micron at frequencies of 2 GHz and 8 GHz.
2 . The method of claim 1 , wherein said depositing comprises an evaporation methods.
3 . The method of claim 1 , wherein in said depositing comprises at least one from the group consisting of: RF sputtering, pulsed laser deposition, or metal organic decomposition (MOD).
4 . The method of claim 1 , wherein said crystalline dielectric film comprises Ba 1-x S rx TiO 3 , where x is from 0.0 to 1.
5 . The method of claim 1 , wherein the crystalline dielectric film comprises at least one material selected from the group consisting of: barium titanate, strontium titanate, barium calcium titanate, barium calcium zirconium titanate, lead titanate, lead zirconium titanate, lead lanthanum zirconium titanate, lead niobate, lead tantalate, potassium strontium niobate, sodium barium niobate/potassium phosphate, potassium niobate, lithium niobate, lithium tantalate, lanthanum tantalate, barium calcium zirconium titanate or sodium nitrate, Ba 1-X Sr X TiO3 (0≦x≦1), Ba X Ca 1-X TiO 3 (0.2≦x≦0.8), Pb X Zr 1-X SrTiO 3 (0.05≦x≦0.4), KTa X Nb 1-X O 3 (0≦x≦1), Pb X Zr 1-X TiO 3 (0≦x≦1), and mixtures and composites thereof.
6 . The method of claim 1 , wherein said buffer layer comprises any phase between amorphous phase and fully crystallized phase
7 . The method of claim 1 , wherein said buffer layer comprises at least one material selected from the group consisting of: barium titanate, strontium titanate, barium calcium titanate, barium calcium zirconium titanate, lead titanate, lead zirconium titanate, lead lanthanum zirconium titanate, lead niobate, lead tantalate, potassium strontium niobate, sodium barium niobate/potassium phosphate, potassium niobate, lithium niobate, lithium tantalate, lanthanum tantalate, barium calcium zirconium titanate or sodium nitrate, Ba 1-X Sr X TiO 3 (0≦x≦1), Ba X Ca 1-X TiO 3 (0.2≦x≦0.8), Pb X Zr 1-X SrTiO 3 (0.05≦x≦0.4), KTa X Nb 1-X O 3 (0≦x≦1), Pb X Zr 1-X TiO 3 (0≦x≦1), and mixtures and composites thereof.
8 . The method of claim 1 , wherein said buffer layer is deposited at a first temperature, and the layer of crystalline dielectric film is deposited at a higher second temperature.
9 . The method of claim 1 , further comprising annealing said buffer layer after it was deposited on said substrate.
10 . The method of claim 1 , further comprising annealing the crystalline dielectric film after it was deposited on a dielectric buffer layer.
11 . (canceled)
12 . The method of claim 1 , wherein the substrate includes a metallic layer.
13 . (canceled)
14 . The method of claim 1 , wherein said tunable dielectric thin film is used within a tunable microwave device.
15 . A method of making a tunable dielectric thin film, comprising:
depositing a first buffer layer on a substrate;
depositing a first layer of crystalline dielectric film on said first buffer layer;
depositing a second buffer layer on said first crystalline dielectric film; and
depositing a second layer of crystalline dielectric film on said second buffer layer, wherein said first layer and said second layer of crystalline dielectric film are capable of dielectric tuning of at least about 10 percent at 50V/micron at frequencies of 2 GHz and 8 GHz.
16 . The method of claim 15 , wherein in said depositing comprises at least one of mechanical, chemical and evaporation methods.
17 . The method of claim 15 , wherein in said depositing comprises at least one of RF sputtering, pulsed laser deposition, pulsed electron deposition, sol-gel processing, metal organic decomposition (MOD), and chemical vapor deposition (CVD).
18 . 4 : 14 PM 1 / 9 / 2006 The method of claim 15 , wherein said first or second crystalline dielectric film comprises at least one material selected from the group consisting of: barium titanate, strontium titanate, barium calcium titanate, barium calcium zirconium titanate, lead titanate, lead zirconium titanate, lead lanthanum zirconium titanate, lead niobate, lead tantalate, potassium strontium niobate, sodium barium niobate/potassium phosphate, potassium niobate, lithium niobate, lithium tantalate, lanthanum tantalate, barium calcium zirconium titanate or sodium nitrate, Ba 1-X Sr X TiO 3 (0≦x≦1), Ba X Ca 1-X TiO 3 (0.2≦x≦0.8), Pb X Zr 1-X TiO 3 (0.05≦x≦0.4), KTa X Nb 1-X O 3 (0≦x≦1), Pb X Zr 1-X TiO 3 (0≦x≦1), and mixtures and composites thereof.
19 . The method of claim 15 , wherein said first or said second buffer layer comprises any phase between amorphous phase and fully crystallized phase
20 . The method of claim 15 , wherein said first or said second buffer layer comprises at least one material selected from the group consisting of: barium titanate, strontium titanate, barium calcium titanate, barium calcium zirconium titanate, lead titanate, lead zirconium titanate, lead lanthanum zirconium titanate, lead niobate, lead tantalate, potassium strontium niobate, sodium barium niobate/potassium phosphate, potassium niobate, lithium niobate, lithium tantalate, lanthanum tantalate, barium calcium zirconium titanate or sodium nitrate, Ba 1-X Sr X TiO 3 (0≦x≦1), Ba x Ca 1-X TiO 3 (0.2≦x≦0.8), Pb X Zr 1-X SrTiO 3 (0.05≦x≦0.4), KTa X Nb 1-X O 3 (0≦x≦1), Pb X Zr 1-X TiO 3 (0≦x≦1), and mixtures and composites thereof.
21 . The method of claim 15 , wherein said first or said second buffer layer and said first or said second crystalline dielectric film is deposited repeatedly as required.
22 . The method of claim 15 , wherein said first or said second buffer layers and said first or said second crystalline dielectric films is deposited repeatedly as required, and a metallic layer is deposited between said first or said second buffer layer and said first or said second crystalline dielectric film.
23 . (canceled)
24 . (canceled)
25 . The method of claim 15 , wherein the substrate further comprises a metallic layer.
26 . (canceled)
27 . The method of claim 15 , wherein the tunable dielectric thin film is used within a tunable microwave device.