Paste for forming an interconnect and interconnect formed from the paste
View Patent ↗A paste for forming an interconnect includes a mixture of binder particles, filler particles and flux material, binder particles having a melting temperature that is lower than that of the filler particles, and the proportion of the binder particles and the filler particles being selected such when heat is applied to melt the binder particles the shape of the paste as deposited is substantially retained thereby allowing for the paste to be used for forming interconnect structures.
1. A conductive paste comprising:
electrically conductive binder particles; and
a plurality of filler particles mixed with said binder particles, wherein said electrically conductive binder particles comprise 50-85% of the total weight of the composition, and said filler particles comprise 5-40% of the total weight of the composition.
2. A conductive paste according to claim 1 , further comprising a flux material, said flux material comprising the balance of the total weight of the composition.
3. A conductive paste according to claim 2 , wherein said flux material comprises 10% of the total weight of the composition.
4. A conductive paste according to claim 1 , wherein said binder particles are 15 μm-50 μm wide.
5. A conductive paste according to claim 1 , wherein said filler particles are 15 μm to 65 μm wide.
6. A conductive paste comprising:
electrically conductive binder particles; and
a plurality of silver-coated filler particles mixed with said binder particles, wherein said electrically conductive binder particles comprise 50-85% of the total weight of the composition, and said filler particles comprise 5-40% of the total weight of the composition.
7. The conductive paste of claim 6 , wherein said binder particles are comprised of solder.
8. The conductive paste of claim 7 , wherein said solder is comprised of tin-silver solder.
9. The conductive paste of claim 8 , wherein said tin-silver solder is a composition substantially consisting of 95.5% Sn, 3.8% Ag, and 0.7% Cu by weight.
10. The conductive paste of claim 7 , wherein said solder is a composition substantially consisting of 95% Sn and 5% Sb by weight.
11. The conductive paste of claim 7 , wherein said solder is a high lead solder.
12. The conductive paste of claim 7 , wherein said solder is a tin-lead solder.
13. The conductive paste of claim 6 , wherein said filler particles are substantially spherical.
14. The conductive paste of claim 6 , wherein said filler particles arc substantially parallelepipedal.
15. The conductive paste of claim 6 , wherein said filler particles are comprised of copper.
16. The conductive paste of claim 6 , wherein said filler particles are comprised of nickel.
17. A conductive paste comprising:
electrically conductive hinder particles; and
a plurality of tin-silver filler particles mixed with said binder particles, wherein said electrically conductive binder particles comprise 50-85% of the total weight of the composition, and said filler particles comprise 5-40% of the total weight of the composition.
18. The conductive paste of claim 17 , further comprising a flux material, said flux material comprising the balance of the total weight of the composition.
19. The conductive paste of claim 18 , wherein said flux material comprises 10% of the total weight of the composition.
20. The conductive paste of claim 17 , wherein said binder particles arc comprised of tin-bismuth.