Method for generating an elecrically contactable area on a doped polymer and formed body produced by this method
View Patent ↗The invention relates to a method for generating at least one electrically contactable area on a polymer which is doped with a conductive substance, wherein a contact material is applied onto the polymer, which has a lower specific resistance at 23° C. than the polymer. According to the invention the contact material is applied onto the polymer so tightly that close contact between the contact material and the conductive substance is achieved. Due to the tight application of the contact material, which has a lower specific resistance than the polymer, the input resistance of the doped polymer is effectively reduced. The invention further concerns a formed body made of a polymer which is doped with a conductive substance, which has at least one contactable area, within which a contact material is applied onto the polymer, which has a lower specific resistance at 23° C. than the polymer. According to the invention the contact material is applied onto the polymer so tightly that it is in close contact to the conductive substance. Such formed body has a significantly reduced input resistance.
1. Formed body made of a polymer which is doped with a conductive substance, comprising:
at least one contactable area, within which area a contact material is applied onto said polymer, wherein said contact material
has a lower specific resistance at 23° C. than said polymer,
is a hot-embossed foil, and
is applied onto said polymer so tightly that it is in close contact with said conductive substance, wherein said formed body is
an electrode and wherein said formed body:
is part of (a) a cuvette having a reaction chamber or (b) at least one reaction chamber of a multiwell plate,
comprises an inner side facing said reaction chamber of (a) or (b), and
comprises an outer side to which said contact material is applied, wherein the outer side is at an exterior surface of (a) or (b) facing away from the reaction chamber of (a) or (b).
2. The formed body according to claim 1 , wherein said contact material has a specific resistance at 23° C. below 1×10 −5 Ohm·cm.
3. The formed body according to claim 2 , wherein said contact material has a specific resistance between 1×10 −6 and 2×10 −6 Ohm·cm.
4. The formed body according to claim 1 , wherein said contact material is a metal or an intrinsically conductive plastic material.
5. The formed body according to claim 1 , wherein a carbon-based material or an adhesion-mediating layer having a low specific resistance is disposed between said polymer and said contact material.
6. The formed body according to claim 5 , wherein said carbon-based material is at least one graphite sheet.
7. The formed body according to claim 1 , wherein said polymer is doped with carbon fibers, graphite, carbon black and/or carbon nanotubes, and wherein the overall concentration of said dope in said polymer is between 50 and 80% w/w.
8. The formed body according to claim 1 , wherein said polymer is polycarbonate, polyetheretherketone, polypropylene, polyamide or a mixture of these polymers.
9. The formed body according to claim 4 , wherein said intrinsically conductive plastic material is polyaniline, polyacetylene, poly-para-phenylene, poly-para-phenylensulfide, polypyrroles, poly-thiophene or polypropylene.
10. The formed body according to claim 1 , wherein as a result of said close contact, a temperature at the contact area between the polymer and the contact material is, when electric current flows, below a softening point of the polymer doped with the conductive substance.
11. The formed body according to claim 1 , wherein the formed body has an inner side and wherein said contact material is at said outer side, but not at said inner side.
12. The formed body according to claim 1 , wherein the close contact of the contact material to the polymer is configured to avoid a burn-in of a contact material even when a voltage as high as 1000 V is applied.