IP Library Granted Patent US 7,704,583
Granted Patent B2
US 7,704,583 · App. 10/973,739 · Granted Apr 27, 2010

Embossed blister pack

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Quick Facts
Patent No.
US 7,704,583
App. No.
10/973,739
Filed
Apr 25, 2005
Granted
Apr 27, 2010
Kind
B2
Examiner
RHEE, JANE J
Art Unit
1795
USPC
428/68
Abstract

The invention herein relates to a method and apparatus for forming (or cold-forming) an embossed blister from a laminated film wherein an indicia is formed on the base of the blister. In particular, the invention involves a single pass process of combining the formation of a blister and the formation of an indicia (embossing) on the blister, wherein the blister-forming pin contains a face with an indicia and is adapted to controllably stretch the laminated film during blister formation to minimize stretching of the film at the base of the blister. The invention is particularly useful in manufacturing processes which involve the formation of blisters having laminated films which contain a metal foil and polymer layer, wherein improved control in the stretching of the laminate during blister formation is desirable.

Claims (4)

1. A blister pack comprising an embossed blister having indicia thereon and structured to mold said indicia onto a solid dosage form formed within said embossed blister,

wherein said blister comprises a laminated film with a blister base film thickness greater than a blister side wall thickness, said blister base being the surface upon which the indicia is formed, and

wherein said blister is formed by advancing a pin having a face with an indicia thereon in a transverse direction relative to the film plane toward and into engagement with a platen bearing an indicia-forming die thereon and located on the opposite side of said film having an initial uniform thickness, said advancing movement of the pin controllably stretching the film at the base of the blister and said pin face comprising at least two contiguous frusto-conical portions adjacent or proximal to the pin face having different apex angles relative to the pin face.

2. The blister pack according to claim 1 , wherein said pin comprises first and second portions, said first portion adjacent to the pin face having an apex angle of about 60 degrees and said second portion adjacent to said first portion having an apex angle of about 30 degrees.

Assignments (1)
RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL (019323/0302) Recorded Dec 19, 2024
From: JPMORGAN CHASE BANK, N.A.
To: CATALENT PHARMA SOLUTIONS, LLC; R.P. SCHERER TECHNOLOGIES, INC.; R.P. SCHERER TECHNOLOGIES, LLC; R.P. SCHERER CORPORATION
Reel/Frame 069750/0933 →