Buffer zone for the prevention of metal migration
View Patent ↗Particle migration, such as silver electro-migration, on a flat ceramic surface is effectively eliminated by an upward vertical barrier formed on the surface or a groove formed in the surface between two silver conductors.
1. A method of retarding electromigration across an insulating surface separating first and second conductors disposed adjacent to said surface, the method comprising the step of forming one of a step, groove, and ridge in or on said surface between said conductors;
wherein said step, groove, or ridge forms a buffer zone that retards electromigration across said surface.
2. A method of preventing particle migration across a substantially flat surface having first and second conductors disposed thereon wherein at least one of said conductors comprises particles that tend to migrate in the presence of an electric field, the method comprising the step of forming a groove in said surface between said conductors;
wherein said groove forms a buffer zone that retards particle migration across said surface.
3. The method of claim 2 wherein said step of forming said groove includes forming said groove with a depth greater than 0.030 inches.
4. The method of claim 2 wherein said step of forming said groove includes forming a portion of at least one side wall of said groove that is within 2 degrees of being perpendicular to the strongest electric field across said portion which would be formed when said first and second conductors are at different electrical potentials.
5. An apparatus comprising:
a) a insulating surface having two spaced apart conductors located on said surface, wherein at least one of the conductors comprises particles that tend to migrate in the presence of an electric field; and
b) a groove in said surface between said conductors that forms a buffer zone, whereby shorts caused by migrating particles between said conductors are substantially eliminated.
6. The apparatus of claim 5 wherein said groove is greater than 0.030 inches deep.
7. The apparatus of claim 5 wherein said two conductors are greater than approximately 0.050 inches apart.
8. The apparatus of claim 5 wherein said groove has a portion of at least one side wall that is within 2 degrees of being perpendicular to the strongest electric field across said portion which would be formed when said first and second conductors are at different electrical potentials.
9. A method of preventing particle migration across a substantially flat insulating surface having first and second conductors disposed thereon wherein at least one of said conductors comprises particles that tend to migrate in the presence of an electric field, the method comprising the step of forming a ridge that provides a buffer zone on said surface between said conductors.
10. The method of claim 9 wherein said step of forming said ridge includes forming said ridge with a height greater than 0.030 inches.
11. The method of claim 9 wherein said step of forming said ridge includes forming a portion of at least one side wall of said ridge that is within 2 degrees of being perpendicular to the strongest electric field across said portion which would be formed when said first and second conductors are at different electrical potentials.
12. An apparatus comprising:
a) an insulating surface having two spaced apart conductors located on said surface, wherein at least one of the conductors comprises particles that tend to migrate in the presence of an electric field; and
b) a ridge that provides a buffer zone on said surface between said conductors whereby shorts caused by migrating particles between said conductors are substantially eliminated.
13. The apparatus of claim 12 wherein said ridge is greater than 0.030 inches high.
14. The apparatus of claim 12 wherein said two conductors are greater than approximately 0.050 inches apart.
15. The apparatus of claim 12 wherein said ridge has a portion of at least one side wall that is within 2 degrees of being perpendicular to the strongest electric field across said portion which would be formed when said first and second conductors are at different electrical potentials.
16. The apparatus of claim 6 , wherein the at least one of the conductors comprising particles that tend to migrate in the presence of an electric field comprises silver.
17. The apparatus of claim 12 , wherein the at least one of the conductors comprising particles that tend to migrate in the presence of an electric field comprises silver.
18. The method of claim 2 , wherein the particles that tend to migrate in the presence of an electric field comprise silver particles.
19. The method of claim 9 , wherein the particles that tend to migrate in the presence of an electric field comprise silver particles.
20. A method of retarding electromigration of particles that tend to move in the direction of an electric field and are present in at least one of spaced apart first and second conductors that are attached to a substantially flat insulating surface, said method comprising:
forming in or on said insulating surface a barrier zone between said first and second conductors, said barrier zone comprising a surface substantially perpendicular to the direction of an electric field formed by a predetermined voltage potential between said two conductors,
wherein the strength of said electric field is substantially reduced, thereby retarding the movement of said particles between said conductors.
21. The method of claim 20 , wherein said barrier zone comprises a ridge.
22. The method of claim 20 , wherein said barrier zone comprises a groove.
23. The method of claim 1 , wherein at least one of said conductors comprises silver.