Method of manufacturing a semiconductor integrated circuit device which prevents foreign particles from being drawn into a semiconductor container containing semiconductor wafers
View Patent ↗When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. A method is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
1. A method of handling a semiconductor device, comprising the steps of:
accommodating a semiconductor wafer in a semiconductor container and conveying the semiconductor container to a semiconductor manufacturing apparatus;
connecting an opening of said semiconductor container and an opening of said semiconductor manufacturing apparatus;
connecting said openings such that a velocity differential pressure ratio obtained by dividing the maximum velocity at the time of vertically opening a held lid of said semiconductor container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less; and
processing a semiconductor wafer accommodated in said semiconductor container.
2. A method of opening and closing a semiconductor container, comprising the steps of:
placing a semiconductor container accommodating a semiconductor wafer on a stage;
connecting an opening of said semiconductor container and an opening of a semiconductor manufacturing apparatus;
holding a lid of said semiconductor container and then opening and closing said lid in a direction vertical to an opening surface of the container with an opener; and
moving down the opener holding the lid of said semiconductor container so as to connect the opening of said semiconductor container and the opening of said semiconductor manufacturing apparatus while both of the openings are opened, or moving up said opener so as to close the connection between said openings,
wherein an operating velocity of opening the container by the opener is set such that a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of said semiconductor container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, becomes 0.06 ((m/s) Pa) or less.
3. A method of opening and closing a semiconductor container, comprising the steps of:
placing a semiconductor container accommodating a semiconductor wafer;
connecting an opening of said semiconductor container and an opening of a semiconductor manufacturing apparatus;
holding a lid of said semiconductor container and then opening and closing said lid in a direction vertical to an opening surface of the container with an opening means;
moving down the opening means holding the lid of said semiconductor container so as to connect the opening of said semiconductor container and the opening of said semiconductor manufacturing apparatus while both of the openings are opened, or moving up said opening means so as to close the connection between said openings; and
preventing foreign particles from being drawn into said semiconductor container during opening of said lid by setting an operating velocity of opening the container by the opening means is set such that a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of said semiconductor container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, becomes 0.06 ((m/s) Pa) or less.