Substrate receiving method

1. A method for receiving a substrate comprising:

transferring a cassette, receiving the substrate on the plates of the cassette, to a cassette loading unit having uploading and downloading functions;

fixing the cassette on the cassette loading unit using clamps, the clamps arranged at corners of the cassette;

inserting the auxiliary plates between plates of the cassette from outside by revolving at least two auxiliary plate support bars, wherein the auxiliary plates are supported by the auxiliary plate support bars arranged on a port, supporting the cassette loading unit, at both sides of the cassette, wherein the auxiliary plates are inserted to be substantially parallel with the plates of the cassette and to be respectively lower than the plates of the cassette, and wherein the auxiliary plates are longer than the plates of the cassette;

after inserting the auxiliary plates, downwardly moving the cassette by the cassette loading unit so as to move substrates from the plates of the cassette to auxiliary plates longer than the plates of the cassette, the downwardly moving the cassette occurring while simultaneous moving the same substrates from plates of the cassette to auxiliary plates;

unloading and loading the same substrates from/on the auxiliary plates in the cassette;

upwardly moving the cassette by the cassette loading unit so as to move the same substrates from the auxiliary plates to the plates of the cassette, the upwardly moving the cassette occurring while simultaneous moving the same substrates from the auxiliary plates to the plates of the cassette; and

wherein the auxiliary plates support the same substrates only within the cassette, and

wherein the same substrates in the cassette are unloaded from the auxiliary plate on a conveying robot arm, entered in the cassette for unloading the same substrates, and are loaded from the conveying robot arm on the auxiliary plate, again entered in the cassette for loading the same substrates.

2. The method for receiving a substrate of claim 1 , further comprising:

storing an etchant in an etching unit;

removing impurities from the etchant in an etchant recycling unit;

storing deionized water in a deionized supply unit;

storing undiluted etchant in an undiluted etchant supply unit;

mixing the deionized water, the undiluted etchant, and the impurity-removed etchant in an etchant mixing unit;

heating the mixed etchant in an etchant heating unit; and

removing the etchant remaining on the substrate in a cleaning unit;

wherein the etching unit, the etchant heating unit, the etchant mixing unit, and the etchant recycling unit are connected to each other through pipes; and

wherein the deionized supply unit and the undiluted etchant supply unit are both connected to the etchant mixing unit through pipes.

3. The method of claim 2 , wherein the etchant includes an HF solution.

4. The method of claim 2 , wherein the etching unit includes an airtight container, a gas supply pipe, and a temperature measuring device.

5. The method of claim 2 , wherein the etchant recycling unit includes a filter removing impurities from the etchant and a storage tank storing the impurity-removed etchant.

6. The method of claim 2 , wherein the etchant mixing unit includes a concentration measuring device and a PCW coolant pipe.