Method and apparatus for a wobble fixture probe for probing test access point structures

1. A method for probing a solder bead probe on a printed circuit board, said method comprising:

aligning a wobble fixture probe with a solder bead probe conductively attached to a trace on a printed circuit board, the solder bead probe comprising a localized high point of solder along the trace of the printed circuit board, and the wobble fixture probe comprising a barrel forming a sleeve around a shaft, the shaft having a first end connected to a contact tip and a second end connected to a compressive force mechanism retained within the barrel, and a retainer mechanism along the shaft which retains the shaft within the barrel, the barrel having a bulge in the wall of the barrel;

bringing the contact tip of the wobble fixture probe into compressive contact with the solder bead probe such that the retainer mechanism contacts the bulge in the barrel as compressive force is applied to the contact tip, causing the shaft to wobble and the contact tip to move in a lateral wiping motion against the solder bead probe.

2. The method of claim 1 , further comprising the step of running one or more tests with the wobble fixture probe in compressive contact with the solder bead probe.

3. The method of claim 1 , wherein the contact tip of the wobble fixture probe is substantially flat.

4. The method of claim 1 , wherein the contact tip of the wobble fixture probe is substantially flat at the surface that contacts the solder bead probe.

5. The method of claim 4 , wherein the contact tip of the substantially flat wobble fixture probe is substantially circular.

6. The method of claim 5 , wherein the diameter of the substantially circular contact tip of the substantially flat wobble fixture probe is appmximately 23–35 mil in diameter.