Optoelectronic components with multi-layer feedthrough structure
View Patent ↗This disclosure concerns a platform suitable for use in connection with optoelectronic components and devices. In one example, the platform includes multiple stacked platform layers. A conductive pathway of the platform is supported by at least one of the stacked platform layers, and the conductive pathway is configured and arranged so as to be at least partly coextensive with the platform.
1. An optical subassembly comprising:
a header assembly comprising:
a base; and
a platform extending through the base and including a plurality of stacked platform layers and at least one conductive pathway, the at least one conductive pathway configured and arranged so as to extend through the base; and
at least one optoelectronic component mounted at least indirectly to the platform of the header assembly.
2. The optical subassembly as recited in claim 1 , wherein the at least one optoelectronic component comprises at least one of: a laser; and, a photodiode.
3. The optical subassembly as recited in claim 1 , wherein the optical subassembly comprises a transmitter optical subassembly.
4. The optical subassembly as recited in claim 1 , wherein the optical subassembly comprises a receiver optical subassembly.
5. The optical subassembly as recited in claim 1 , wherein each of the stacked platform layers substantially comprises an insulative material.
6. The optical subassembly as recited in claim 1 , wherein the at least one conductive pathway has a geometry that corresponds to a desired impedance.
7. The optical subassembly as recited in claim 1 , wherein the at least one conductive pathway comprises an electrically conductive trace, at least a portion of which is patterned on a surface of at least one of the stacked layers.
8. The optical subassembly as recited in claim 1 , wherein the platform is substantially hermetically sealed to the base.
9. The optical subassembly as recited in claim 1 , wherein the plurality of stacked platform layers comprises:
an upper insulating layer;
an intermediate layer; and
a lower layer.
10. The optical subassembly as recited in claim 1 , wherein the at least one conductive pathway comprises at least one of each of the following:
a high speed transmission line;
a general signal line; and
a ground signal line.
11. The optical subassembly as recited in claim 1 , wherein the at least one conductive pathway is substantially embedded in one of the stacked layers.
12. The optical subassembly as recited in claim 1 , wherein the at least one conductive pathway is located substantially on a single one of the stacked layers.
13. The optical subassembly as recited in claim 1 , wherein different portions of the at least one conductive pathway are located on different respective stacked layers.
14. The optical subassembly as recited in claim 1 , wherein the at least one conductive pathway electrically interconnects the at least one optoelectronic component with another component.
15. The optical subassembly as recited in claim 1 , wherein one of the stacked platform layers comprises a sealing layer positioned to prevent electrical contact between the at least one conductive pathway and the base.
16. The optical subassembly as recited in claim 1 , further comprising a metallization layer deposited on at least a portion of the platform so as to be interposed between the base and the platform.
17. The optical subassembly as recited in claim 1 , further comprising a cap attached to the base and cooperating with the base to enclose at least a portion of the platform and the at least one optoelectronic component.
18. The optical subassembly as recited in claim 1 , further comprising a submount attached to the platform and to which the at least one optoelectronic component is mounted.
19. The optical subassembly as recited in claim 18 , wherein the submount is integral with the platform.
20. The optical subassembly as recited in claim 1 , further comprising:
an outer casing within which at least part of the header assembly is enclosed;
an lens assembly located within the outer casing proximate the at least one optoelectronic component;
an isolator interposed between the lens assembly and the at least one optoelectronic component;
a receptacle connected to the outer casing and substantially aligned with the isolator; and
a cap attached to the base and cooperating with the base to enclose the at least one optoelectronic component and a portion of the platform, the cap being located within the outer casing proximate the lens assembly.