Optical device, method for fabricating optical device, cap component, and method for forming cap component
View Patent ↗An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.
1. An optical device comprising:
a base;
a flexible substrate with a wiring pattern, the flexible substrate being bent and disposed along an upper surface and both side surfaces of the base;
an optical chip fixed on the base and electrically connected to the wiring pattern of the flexible substrate; and
a frame fitting the flexible substrate to the base along the both side surfaces of the base and having an opening for setting a light-transmitting member over the optical chip,
wherein the flexible substrate has an opening in a center portion thereof and a center portion of the opening of the flexible substrate is located above the base, and the optical chip is fixed on the upper surface of the base and within the opening of the flexible substrate.
2. The device of claim 1 ,
wherein the frame is formed of a metal plate.
3. The device of claim 1 ,
wherein the frame is fitted to the flexible substrate via an adhesive.
4. The device of claim 1 ,
wherein the base is formed to fix the fixing position of the flexible substrate.
5. The device of claim 1 , wherein the light-transmitting member is set in the opening of the frame.
6. The device of claim 5 , wherein the light-transmitting member is a hologram.
7. The device of claim 5 , wherein the light-transmitting member is a window made of glass or plastic.
8. The device of claim 1 , wherein center parts of side portions of the frame are located within the opening of the flexible substrate and fitted to the base via an adhesive, and both edge parts of the side portions of the frame are fitted to the flexible substrate via an adhesive.
9. The device of claim 1 , wherein the optical chip includes a light receiving element and a light emitting element.
10. The device of claim 9 , wherein the light emitting element is fixed on the light receiving element.
11. An optical device comprising:
a base;
a flexible substrate with a wiring pattern, the flexible substrate being bent and disposed along an upper surface and both side surfaces of the base;
an optical chip fixed on the base and electrically connected to the wiring pattern of the flexible substrate; and
a frame fitting the flexible substrate to the base along the both side surfaces of the base and having an opening for setting a light-transmitting member over the optical chip.
wherein the flexible substrate bent and disposed along the upper surface and the both side surfaces of the base is provided at both side ends thereof with external terminals for signal connection to external equipment, and the external terminals are located below the base.
12. The device of claim 11 , wherein the frame is formed of a metal plate.
13. The device of claim 11 , wherein the light-transmitting member is set in the opening of the frame.
14. The device of claim 13 , wherein the light-transmitting member is a hologram.
15. The device of claim 13 , wherein the light-transmitting member is a window made of glass or plastic.
16. An optical device comprising:
a base
a flexible substrate with a wiring pattern, the flexible substrate being bent and disposed along an upper surface and both side surfaces of the base;
an optical chip fixed on the base and electrically connected to the wiring pattern of the flexible substrate; and
a frame fitting the flexible substrate to the base along the both side surfaces of the base and having an opening for setting a light-transmitting member over the optical chip,
wherein the wiring pattern of the flexible substrate comprises internal terminals located both sides of the opening and above the upper surface of the base and external terminals located below the base along the both side surfaces of the base, and the optical chip and the internal terminals are electrically connected to each other.
17. The device of claim 16 , wherein the frame is formed of a metal plate.
18. The device of claim 16 , wherein the light-transmitting member is set in the opening of the frame.
19. The device of claim 18 , wherein the light-transmitting member is a hologram.
20. The device of claim 18 , wherein the light-transmitting member is a window made of glass or plastic.